Christian-albrechts-universitaet Zu Kiel

Samsung Electronics Co., Ltd.

Nascit Gmbh

Juergen Carstensen

Rainer Adelung

Melike Baytekin-Gerngross

Mark-Daniel Gerngross

Joerg Bahr

Helmut Foell

Emmanuel Ossei-Wusu

Oliver Riemenschneider

Hauke Hartz

Ingo Paulowicz

Sandra Noehren

Ala Cojocaru

Bjoern Bosbach

Bodo Fiedler

An adhesive joining device for providing a connection between a metal surface and a body using an electrochemical etching device. The device has a vacuum holder to form a vacuum connection between the adhesive joining device and the metal surface. A tool changing holder receives at least two different tools in a time-staggered manner. A first tool can be an electrochemical etching cell for an electrolyte with an etching chamber which is oriented towards the metal surface, a feed for electrolyte, a drain, and two electrodes, one electrode being mechanically and electrically connected to the metal surface and the second electrode coming into contact with the electrolyte. A second tool is for holding and positioning the body to be adhered to the etched metal surface. The distance, position, alignment, and/or parallelity of the body to be adhered can be configured in a reliable and defined manner for the adhesion process.

Adhesive joining device and adhesive joining method for a metal surface

A plastic fiber composite material/aluminum laminate having: at least one flat element made of aluminum and/or an aluminum alloy and a plastic fiber composite material comprising a matrix material which has a temporarily flowable and then hardened state initially or at least under a temperature effect. The at least one flat element has etched anchoring structures, the anchoring structures have steps and undercuts, and the anchoring structures are filled and/or enclosed by the matrix material of the plastic fiber composite material. Use of the plastic fiber composite material/aluminum laminate and a method for producing the plastic fiber composite material/aluminum laminate.

Plastic fiber composite material/aluminum laminate, production and use thereof

A method for etching fragments of aluminum or an aluminum alloy comprising the steps of: a. providing a hydrochloric acid solution in a trough-shaped container; b. inoculating the hydrochloric acid solution by chemically dissolving an amount of aluminum to produce an etching solution; c. adding the fragments to the etching solution immediately after the inoculation; d. etching the fragments for 0.5 to 10 minutes while stirring in such a way that the fragments are entrained by the motion of the etching solution; e. stopping the etching by diluting the etching solution with water; f. removing the etched fragments; g. repeatedly rinsing the fragments with water and h. rinsing the fragments with an organic desiccant. An etched fragment of aluminum or an aluminum alloy and also to a composite material comprising etched fragments.

Method for etching the surface of aluminum fragments, aluminum fragments with an etched surface and material composites containing such fragments

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

Aluminum-copper connector having a heterostructure, and method for producing the heterostructure

Method for producing metallic surface discharge electrodes on nonmetallic substrates comprising the following steps: a) producing a metallic seed layer on a substrate; b) electrically contacting the seed layer with a metal wire network and an electrolyte containing metal ions; c) electrodepositing a metal film from the electrolyte at least on the seed layer, with the metal wire network being embedded into the metal film, wherein d) metal wire filaments that are movable relative to one another are arranged to form an electrically percolating metal wire network, e) the arrangement of the metal wire filaments is cast into a gel and the gel is dried thereafter to the gel matrix, and f) the dried gel matrix with the metal wire network embedded therein is applied to the substrate and is wetted with a solvent of the gel matrix. Furthermore, the invention relates to a semifinished product for carrying out the method.

Method for producing surface discharge electrodes and semifinished product for carrying out the method

An electrode for lithium ion batteries, the electrode having a metal film which is inert to lithium ions and having a plurality of silicon nanowires protruding from the film, which are arranged on at least one flat side of the film, wherein sections of the nanowires are enclosed by the metal film.

Method for manufacturing an electrode for lithium ion batteries

Electrode for lithium ion batteries

Method for the electrochemical etching of macropores in n-type silicon wafers, using illumination of the wafer reverse sides and using an aqueous electrolyte, characterized in that the electrolyte is an aqueous acetic acid solution with the composition of HO:CHCOOH in the range between 2:1 and 7:3, with an addition of at least 9 percent by weight hydrofluoric acid.

Growing community of inventors

Kiel, Germany

Juergen Carstensen