Robert Bosch

Juergen Butz

Heribert Weber

Jochen C Beintner

Frieder Haag

Axel Franke

Tjalf Pirk

Rainer Straub

Heiko Stahl

Arnim Hoechst

Bernhard Gehl

Christoph Hermes

Jochen Tomaschko

Thomas Mayer

Sonja Knies

Andreas Hartlieb

Christof Single

Hans-Peter Diercks

A method for closing openings in a flexible diaphragm of a MEMS element. The method includes: providing at least one opening in the flexible diaphragm, situating sealing material in the area of the at least one opening, melting-on at least the applied sealing material in the area of the at least one opening, and subsequently cooling the melted-on material to close the at least one opening.

Method for closing openings in a flexible diaphragm of a MEMS element

A polycrystalline material having low mechanical strain is provided. The polycrystalline material includes one or multiple layers of a first type and one or multiple layers of a second type. The layers of the first type and the layers of the second type each include at least one polycrystalline material component. The layers of the first type have a smaller average crystal grain size than the layers of the second type, a layer of the first type and a layer of the second type being situated, at least in part, one above the other in an alternating sequence, and it being the case for the transition between the layers of the first type and the layers of the second type to be abrupt or continuous.

Polycrystalline material having low mechanical strain; method for producing a polycrystalline material

A manufacturing method is provided for a piezoelectric layer arrangement and a corresponding piezoelectric layer arrangement. The manufacturing method includes the steps: depositing a first electrode layer on a substrate; depositing a first insulating layer on the first electrode layer; forming a through opening in the first insulating layer to expose the first electrode layer within the through opening; depositing a piezoelectric layer on the first insulating layer and on the first electrode layer within the through opening; back-polishing the resulting structure to form a planar surface, on which a piezoelectric layer area, surrounded by the first insulating layer, is exposed; and depositing and structuring a second electrode layer on the first insulating layer, which contacts the piezoelectric layer area.

Manufacturing method for a piezoelectric layer arrangement and corresponding piezoelectric layer arrangement

A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Method for constructing an electrical circuit, and electrical circuit

A multi-beam phase-array antenna device includes beam configuring devices (BFN) arranged in respective separate groups behind corresponding radiator elements (SE1 . . . SEm). In each group the beam configuring devices (BFN) are arranged one after the other along a first predetermined direction behind the associated radiator element. The number of beam configuring devices in each separate group is selected according to the number (n) of antenna signals. A signal combining device (SK) is provided for each separate group of beam forming devices (BFN). Signal distributing devices (VR1 . . . VRn) for control of the beam configuring devices are preferably mounted on the rear side of a circuit-carrying substrate (SU) for the beam configuring devices (BFN), in order to provide a compact structure. An especially compact and economical structure is provided when the transverse cross-section of each group is adjusted to the area of the associated radiator element.

Multi-beam phase-array antenna device

Growing community of inventors

Reutlingen, Germany

Juergen Butz