Eth Zurich

Mellanox Technologies, Ltd.

Aristotle University of Thessaloniki

Karlsruher Institut Fur Technologie

Juerg Leuthold

Elad Mentovich

Paraskevas Bakopoulos

Dimitrios Kalavrouziotis

Christian Koos

Wolfgang Heni

Claudia Hoessbacher

Dimitrios Tsiokos

Claudius Weimann

Maurizio Burla

A push-pull device () comprises: a first waveguide (W) arranged between its first and second electrode (S, S) and a second waveguide (W) arranged between its first and a second electrode (S, S). Electrically conductive structures (T, T, T, T) extend away from one or more of the electrodes (S, S, S, S) for electrically connecting at least two of the electrodes (S, S, S, S). The waveguides (W, W) and the electrodes (S, S, S, S) originate from a pre-fabrication process. The waveguides (W, W) are poled by a poling (P) originating from a poling process. The electrically conductive structures (T, T, T, T) originating: from the pre-fabrication process, wherein one or more of the electrically conductive structures (T, T, T, T) extend to one or more electrically non-conductive gaps (G, G), and wherein the device () further comprises one or more electrically conductive elements (C, C) for electrically connecting two of the electrodes (S, S, S, S), the electrically conductive elements (C, C) being related to the electrically non-conductive gaps (G, G) and originating from a post-fabrication process; and/or from a post-fabrication process.

Push-pull device and method for fabricating a push-pull device

An optoelectronic device () includes thin film structures () disposed on a semiconductor substrate () and patterned to define components of an integrated drive circuit, which is configured to generate a drive signal. A back end of line (BEOL) stack () of alternating metal layers () and dielectric layers () is disposed over the thin film structures. The metal layers include a modulator layer (), which contains a plasmonic waveguide () and a plurality of electrodes (), which apply a modulation to surface plasmons polaritons (SPPs) propagating in the plasmonic waveguide in response to the drive signal. A plurality of interconnect layers are patterned to connect the thin film structures to the electrodes. An optical input coupler () is configured to couple light into the modulator layer, whereby the light is modulated by the modulation of the SPPs, and an optical output coupler () is configured to couple the modulated light out of the modulator layer.

Integrated plasmonic modulator

Disclosed is an electronic device () for converting a wireless signal () in the mm-wave or sub-THz range into at least one modulated optical signal (). The electronic device () comprises an antenna element () for converting the wireless signal () into a guided electrical signal (), wherein the antenna element () is arranged on a printed circuit board (') or on a first integrated chip (&#x2032;). The electronic device () comprises an electrical signal converter () for converting the at least one guided electrical signal () into a conditioned electrical signal (), wherein the electrical signal converter () is arranged on a second integrated chip (&#x2033;). The electronic device () comprises a modulator () for converting the conditioned electrical signal () into the modulated optical signal (), wherein the modulator () is arranged on a third integrated chip (&#x2032;&#x2033;), and wherein the modulator () comprises a waveguide () and a cladding () comprising a first cladding portion () having a conductive material at an interface with the waveguide () and a second cladding portion () having a conductive material at an interface with the waveguide ().

Electronic device for converting a wireless signal into at least one modulated optical signal

Growing community of inventors

Neerach, Switzerland

Juerg Leuthold