Taiwan Semiconductor Manufacturing Comp. Ltd.

Juei-Feng Hsu

Yung-Min Cheng

Yao-Tung Liu

Chun-Sheng Wang

Ming-Hui Lin

Chun-Tsung Yang

Sheng-Guei Chang

Within a method for electrical testing a series of microelectronic fabrication die fabricated within a microelectronic fabrication substrate, there is first electrically tested the series of microelectronic fabrication die to determine at least one sub-series of electrically unacceptable microelectronic fabrication die. Similarly, there is also determined whether the microelectronic fabrication substrate may be reworked. Finally, there is also electrically retested only the at least one sub-series of electrically unacceptable microelectronic fabrication die, and only if the microelectronic substrate may be reworked. The method provides for enhanced efficiency when electrically testing the series of microelectronic fabrication die.

Microelectronic fabrication die electrical test method providing enhanced microelectronic fabrication die electrical test efficiency

Within both an electrical test apparatus for electrically testing a substrate, and a method for electrically testing the substrate while employing the electrical test apparatus, there is provided for an automatic selection of an electrical test program, absent operator intervention, once having identified a substrate. Due to the absence of operator intervention, the substrate is more accurately electrically tested.

Microelectronic fabrication electrical test apparatus and method providing enhanced electrical test accuracy

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Tainan, Taiwan

Juei-Feng Hsu