Advanced Micro Devices Corporation

Globalfoundries Inc.

Hussmann Corporation

Advance Micro Devices, Inc.

Innovative Foundry Technologies B.v.

Judy Xilin An

Bin Yu

Haihong Wang

Zoran Krivokapic

Srikanteswara Dakshina-Murthy

William George En

Matthew S Buynoski

Ming-Ren Lin

Cyrus E Tabery

Shibly S Ahmed

Srinath Krishnan

Concetta E Riccobene

Yowjuang William Liu

Che-Hoo Ng

Richard P Rouse

Rasit Onur Topaloglu

Chih-Yuh Yang

Dong-Hyuk Ju

Carl Robert Huster

Ciby Thuruthiyil

Zhi-Yuan Wu

Ali Icel

Sushant S Suryagandh

A double gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin, a first gate and a second gate. The first gate is formed on top of the fin. The second gate surrounds the fin and the first gate. In another implementation, a triple gate MOSFET includes a fin, a first gate, a second gate, and a third gate. The first gate is formed on top of the fin. The second gate is formed adjacent the fin. The third gate is formed adjacent the fin and opposite the second gate.

Double and triple gate MOSFET devices and methods for making same

A double gate germanium metal-oxide semiconductor field-effect transistor (MOSFET) includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, and a second gate formed adjacent a second side of the germanium fin opposite the first side. A triple gate MOSFET includes a germanium fin, a first gate formed adjacent a first side of the germanium fin, a second gate formed adjacent a second side of the germanium fin opposite the first side, and a top gate formed on top of the germanium fin. An all-around gate MOSFET includes a germanium fin, a first sidewall gate structure formed adjacent a first side of the germanium fin, a second sidewall gate structure formed adjacent a second side of the germanium fin, and additional gate structures formed on and around the germanium fin.

Germanium MOSFET devices and methods for making same

According to one exemplary embodiment, a method for producing a quality assured semiconductor device model when at least one critical parameter of a semiconductor device process is upgraded includes verifying the quality assured semiconductor device model for consistency against measured data or projected targets. The method further includes verifying the quality assured semiconductor device model for accuracy and consistency when one of a number of critical parameters is varied. The method further includes verifying consistency of the quality assured semiconductor device model against an old semiconductor device model. The method further includes verifying the quality assured semiconductor device model over a range of each of a number of semiconductor device dependencies. The method further includes verifying the quality assured semiconductor device model for digital circuit operation. The method further includes verifying the quality assured semiconductor device model for analog circuit operation. The method further includes verifying convergence of the quality assured semiconductor device model.

Method for quality assured semiconductor device modeling

A device includes a fin, a first gate and a second gate. The first gate is formed adjacent a first side of the fin and includes a first layer of material having a first thickness and having an upper surface that is substantially co-planar with an upper surface of the fin. The second gate is formed adjacent a second side of the fin opposite the first side and includes a second layer of material having a second thickness and having an upper surface that is substantially co-planar with the upper surface of the fin, where the first thickness and the second thickness are substantially equal to a height of the fin.

A semiconductor device includes a group of fin structures. The group of fin structures includes a conductive material and is formed by growing the conductive material in an opening of an oxide layer. The semiconductor device further includes a source region formed at one end of the group of fin structures, a drain region formed at an opposite end of the group of fin structures, and at least one gate.

FinFET device with multiple fin structures

A method for operating an integrated circuit tester information processing system includes: measuring current information from test structures for an integrated circuit having a stress liner; forming a transfer curve by simulating based on the current information with a first range of first mobility multipliers; forming an inverse transfer curve by applying an inverse transfer function to the transfer curve; forming a stress curve with second mobility multipliers from the inverse curve; and validating the second mobility multipliers by comparing a measured curve and a simulated curve with the measured curve based on the current information and the simulated curve based on stress curve.

Integrated circuit tester information processing system for nonlinear mobility model for strained device

A method for operating an integrated circuit tester information processing system includes measuring current information from test structures for an integrated circuit having dual stress liners; selecting currents from the current information or stored current information; deriving a scaling factor with the currents for a stress contribution based on an active area of a circuit element in the integrated circuit; and correlating the stress contribution with the integrated circuit.

Integrated circuit tester information processing system

A method for forming one or more FinFET devices includes forming a source region and a drain region in an oxide layer, where the oxide layer is disposed on a substrate, and etching the oxide layer between the source region and the drain region to form a group of oxide walls and channels for a first device. The method further includes depositing a connector material over the oxide walls and channels for the first device, forming a gate mask for the first device, removing the connector material from the channels, depositing channel material in the channels for the first device, forming a gate dielectric for first device over the channels, depositing a gate material over the gate dielectric for the first device, and patterning and etching the gate material to form at least one gate electrode for the first device.

FinFET device with multiple channels

A semiconductor device may include a substrate and an insulating layer formed on the substrate. A fin may be formed on the insulating layer. The fin may include a side surface and a top surface, and the side surface may have a &#x3c;100&#x3e; orientation. A first gate may be formed on the insulating layer proximate to the side surface of the fin.

Formation of semiconductor devices to achieve &#x3c;100&#x3e; channel orientation

A triple gate metal-oxide semiconductor field-effect transistor (MOSFET) includes a fin structure, a first gate formed adjacent a first side of the fin structure, a second gate formed adjacent a second side of the fin structure opposite the first side, and a top gate formed on top of the fin structure. A gate around MOSFET includes multiple fins, a first sidewall gate structure formed adjacent one of the fins, a second sidewall gate structure formed adjacent another one of the fins, a top gate structure formed on one or more of the fins, and a bottom gate structure formed under one or more of the fins.

Tri-gate and gate around MOSFET devices and methods for making same

A method of forming a semiconductor device includes forming a fin on an insulating layer, where the fin includes a number of side surfaces, a top surface and a bottom surface. The method also includes forming a gate on the insulating layer, where the gate has a substantially U-shaped cross-section at a channel region of the semiconductor device.

Method of manufacturing a semiconductor device having a fin structure

A double-semiconductor device includes a substrate, an insulating layer, a fin and a gate. The insulating layer is formed on the substrate and the fin is formed on the insulating layer. The fin has a number of side surfaces, a top surface and a bottom surface. The gate is formed on the insulating layer and surrounds the top surface, bottom surface and the side surfaces of the fin in the channel region of the semiconductor device. Surrounding the fin with gate material results in an increased total channel width and more flexible device adjustment margins.

Semiconductor device having a gate structure surrounding a fin

A narrow channel FinFET is described herein with a narrow channel width. A protective layer may be formed over the narrow channel, the protective layer being wider than the narrow channel.

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San Jose, CA, United States of America

Judy Xilin An