Vlsi Technology, Inc.

Judy U Galloway

Daniel D Siems

Pierre Leroux

Anthony Sayka

Stacy W Hall

Mark W Haley

Delbert H Parks

Edward R Vokoun, Iii

Bryan D Schmidt

Clayton Lantz

Henry B Taylor, Iii

A method for cleaning bonding pads on a semiconductor device, as disclosed herein, includes treating the bonding pads with a CF and water vapor combination. In the process, the water vapor breaks up and the hydrogen from the water vapor couples to fluorine residue on the bonding pad surface creating a volatile HF vapor. In addition, fluorine from the CF exchanges with the titanium in the metallic polymer residue making the polymer more soluble for the organic strip operation which follows. Next, the resist is ashed and then an organic resist stripper is applied to the bonding pad area, thereby creating a clean bonding pad surface. Thereafter, a reliable bond wire connection can be made to the bonding pad.

Method for cleaning integrated circuit bonding pads

A method and process for reducing edge-related defects. The present invention comprises the steps of calibrating multiple process units such that the multiple process units are equally referenced with respect to an edge of a semiconductor wafer. The calibrated multiple process units are then utilized to precisely control respective termination distances of deposited substrate layers with respect to the edge of the semiconductor wafer. Furthermore, the deposited substrate layers are selectively stacked in manner which prevents semiconductor wafer edge-related defects. In so doing, the present claimed invention increases semiconductor device yields.

Wafer edge sealing

Method and apparatus for detecting the presence of selected types of defects, such as chemical stains from a liquid photoresist material or a liquid dielectric material, on a non-visible chosen surface of a semiconductor water that has undergone at least one processing step. In one embodiment, a support substrate for, the wafer is provided that has a highly reflecting surface adjacent to the chosen surface. The reflecting surface and the chosen surface are moved apart, and the chosen surface is illuminated with light to form an optical image of the chosen surface. The optical image of the chosen surface is reflected in the reflecting surface, and the reflected optical image is examined for the presence of selected types of defects. In another embodiment, a portion of this reflecting surface is initially contiguous to the chosen surface. A selected defect, if any, on the chosen surface changes a surface characteristic of the reflecting surface so that the presence of this defect on the chosen surface is visually perceptible on the reflecting surface.

Semiconductor wafer defect monitoring

Disclosed is an apparatus and method for transporting wafer cassettes. A wafer cassette handle is characterized by an elongated cylindrical handle positioned horizontal and in parallel to the front face of a wafer cassette and attached to the cassette by engagement members engaging grooves provided in the cassette. The operator's hand carries the handle and cassette by grasping the handle in an underhand grip with the back of the hand engaging the front face of the cassette or a support plate connected to the handle. The underhand grip minimizes wrist strain and encourages operators to hold the cassette high in the air, where particulate contamination is at a minimum.

Wafer cassette handle

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Fairoaks, TX, United States of America

Judy U Galloway