Henkel Ag & Company, Kgaa

Judith Siepenkothen

Ruediger Butterbach

Siegfried Kopannia

Carsten Schubert

Juergen Foell

Luca Mario Marchese

Fabio Angelo Spada

Patrick Markiefka

Fabio Ticozzelli

Rüdiger Butterbach

Jurgen Foll

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.

Thermally conductive adhesive

The invention discloses a hot melt composition comprising a block copolymer consisting of at least two blocks as reaction product of a polyamide having a molecular weight of 5000 g/mol to 100000 g/mol and a modified olefin copolymer having a molecular weight of 3000 to 100000 g/mol and containing covalently bound organic acid anhydride groups to the polymer chain, wherein the polyamide has an amine number from 0.2 to 10 and the olefin copolymer has an acid number from 1 to 100.

Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer

A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150&#xb0; C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190&#xb0; C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

Reactive two-component hotmelt adhesive composition

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Ratingen, Germany

Judith Siepenkothen