National Technology & Engineering Solutions of Sandia, LLC

Unm Rainforest Innovations

Vacuum Process Engineering, Inc.

Judith Maria Lavin

Murat Okandan

Gregory Nolan Nielson

Paul J Resnick

Jose Luis Cruz-Campa

David Michael Keicher

Eric Langlois

Matthew David Carlson

Andrew T Wilson

Carl Schalansky

Lok-kun Tsui

Yasmin Dennig

Yongkun Sui

Alfred J Thibodeaux

A method for direct write printing of an electrical or optical element based upon a generated master actual position map and a master expected position map is disclosed. The generated master actual position map is generated by efficiently stitching together a number of images using a hierarchical stitching process. Once the desired location of the electrical or optical element is determined by comparing the master actual position map with the master expected position map, a corresponding toolpath for a direct write printer is generated. The direct write printer then direct write prints the electrical or optical element using the generated toolpath. By using different types of inks, the electrical element may be a trace, a resistor, an inductor, a transformer, a capacitor, or some combination thereof. In like manner, the optical element may be a waveguide, a beam-splitter, a phase shifter, an optical attenuator, an interferometer, or some combination thereof.

Part position recognition for printing electrical or optical interconnects

Plasma micro nozzle adapters having various configurations and operating principles are disclosed. The plasma micro nozzle adapter is employed with a commercial plasma jet printer to produce smaller printed features than those possible with the original plasma jet printer. In a first class of embodiments, the plasma micro nozzle adapter narrows a plasma jet using electrostatic or magnetostatic lensing, permitting the printing of ceramic, metallic, dielectric, or plastic features with line widths of 10 μm or less. In a second class of embodiments, the plasma micro nozzle adapter narrows the plasma jet using a gas sheath. By adjusting the flow rate or pressure of the gas used to form the gas sheath, the cross-sectional shape of the plasma jet may form, for example, an ellipse, thereby controlling the width of the printed feature. A third class of embodiments employs both electrostatic (or magnetostatic) lensing along with the gas sheath.

Plasma micronozzle adapter

Highly conductive electrical traces formed over mechanical steps or on non-planar surfaces with linewidths of 10 to 100 &#x3bc;m and a method for forming such electrical traces are disclosed. The method employs two steps, with the first step using an aerosol jet printing (AJP) process to form thin electrical traces that serve as the seed layers for the second step. The first step preferably employs multiple passes with the AJP to create multiple seed sub-layers with improved continuity and conductivity. In the second step, the seed layers are subjected to an electrodeposition process that forms the bulk of the thickness of the electrical traces. The electrodeposition process may include one, two, or three phases at corresponding low or high biases, with low biases providing denser, more highly conductive plating sub-layers, while high biases provide plating sub-layers having better gap bridging properties.

High resolution, high conductivity components by aerosol jet printing

Hybrid additive featured plates used to form an overall microchannel heat exchanger and corresponding method of manufacture are disclosed. Various additive manufacturing (AM) techniques may be used to form walls defining microchannel features on a plate substrate. The manufacturing method is a hybrid process in that leverages both additive and conventional manufacturing techniques to minimize both cost and fabrication time.

Additively featured plates for heat exchangers

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

Apparatus for assembly of microelectronic devices

Growing community of inventors

Albuquerque, NM, United States of America

Judith Maria Lavin