Tesa Se

Judith Grünauer

Klaus Keite-Telgenbüscher

Bernd Lühmann

Thilo Dollase

Jan Ellinger

Thorsten Krawinkel

Anika Petersen

Hans Karl Engeldinger

Klaus Keite-Telgenbüsher

Minyoung Bai

Anja Staiger

Alexander Steen

Christian Lammel

Jessika Gargiulo

Klaus Telgenbüscher

Hans-Karl Engeldinger

A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.

Heat-activated, glueable surface elements

The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Adhesive tape containing getter material

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

Adhesive tape for encapsulating an organic electronic arrangement

Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B), (A-B)X, or (A-B-A)X, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.

Cross-linkable adhesive compound with hard and soft blocks as a permeant barrier

Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B), (A-B)X, or (A-B-A)X, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and

Temperature-stable cross-linkable adhesive compound with hard and soft blocks

The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

Adhesive compound and method for encapsulating an electronic arrangement

A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.

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Hamburg, Germany

Judith Grünauer