International Business Machines Corporation

Globalfoundries Inc.

Jude A Rivers

Pradip Bose

Victor V Zyuban

Vijayalakshmi Srinivasan

John-David Wellman

Michael K Gschwind

Alper Buyuktosunoglu

Eren Kursun

Sumedh Wasudeo Sathaye

Erik Richter Altman

Philip George Emma

Hillery C Hunter

Xiaochen Guo

Jaime Humberto Moreno

Zhigang Hu

Galen A Rasche

Jayanth Srinivasan

Balaram Sinharoy

David Arnold Luick

Prabhakar Nandavar Kudva

Daniel Arthur Prener

Arpith C Jacob

Xiaodong Li

Robert K Montoye

Hans Mikael Jacobson

Stanley Everett Schuster

Sameh W Asaad

Xiaowei Shen

John Timothy Robinson

Peter William Cook

Jeonghee Shin

Pia Naoko Sanda

Daniel M Citron

Vinodh R Cuppu

A system and method for projecting reliability to manage system functions includes an activity module which determines activity in the system. A reliability module interacts with the activity module to determine a reliability measurement for the module in real-time based upon the activity and measured operational quantities of the system. A management module manages actions of the system based upon the reliability measurement input from the reliability module. This may be to provide corrective action, to reallocate resources, or increase reliability of the module.

Method and apparatus for monitoring and enhancing on-chip microprocessor reliability

A processor and a method implemented by the processor to obtain computation results are described. The processor includes a unified reuse table embedded in a processor pipeline, the unified reuse table including a plurality of entries, each entry of the plurality of entries corresponding with a computation instruction or a set of computation instructions. The processor also includes a functional unit to perform a computation based on a corresponding instruction.

Processor with memory-embedded pipeline for table-driven computation

Systems and methods to manage memory on a spin transfer torque magnetoresistive random-access memory (STT-MRAM) are provided. A particular method may include determining a performance characteristic using relationship information that relates a bit error rate to at least one of a programming pulse width, a temperature, a history-based predictive performance parameter, a coding scheme, and a voltage level also associated with a memory. The performance characteristic is stored and used to manage a write operation associated with the memory.

Determining and storing bit error rate relationships in spin transfer torque magnetoresistive random-access memory (STT-MRAM)

Systems and methods to manage memory on a spin transfer torque magnetoresistive random-access memory (STT-MRAM) are provided. A particular method of managing memory includes determining a temperature associated with the memory and determining a level of write queue utilization associated with the memory. A write operation may be performed based on the level of write queue utilization and the temperature.

Dynamic temperature adjustments in spin transfer torque magnetoresistive random-access memory (STT-MRAM)

A computer program product for generating and implementing a three-dimensional (3D) computer processing chip stack plan. The computer readable program code includes computer readable program code configured for receiving system requirements from a plurality of clients, identifying common processing structures and technologies from the system requirements, and assigning the common processing structures and technologies to at least one layer in the 3D computer processing chip stack plan. The computer readable program code is also configured for identifying uncommon processing structures and technologies from the system requirements and assigning the uncommon processing structures and technologies to a host layer in the 3D computer processing chip stack plan. The computer readable program code is further configured for determining placement and wiring of the uncommon structures on the host layer, storing placement information in the plan, and transmitting the plan to manufacturing equipment. The manufacturing equipment forms the 3D computer processing chip stack.

Enhanced modularity in heterogeneous 3D stacks

A method for generating and implementing a three-dimensional (3D) computer processing chip stack plan that includes receiving system requirements from a plurality of clients, identifying common processing structures and technologies from the system requirements, and assigning the common processing structures and technologies to a layer in the 3D computer processing chip stack plan. The method also includes identifying uncommon processing structures and technologies from the system requirements and assigning the uncommon processing structures and technologies to a host layer in the 3D computer processing chip stack plan. The method further includes determining placement and wiring of the uncommon structures on the host layer, storing placement information in the plan, and transmitting the plan to manufacturing equipment. The manufacturing equipment generates and integrates both the layer including the common structures and technologies and the host layer including the uncommon structures and technologies to form the 3D computer processing chip stack.

A graph analytics appliance can be employed to extract data from a graph database in an efficient manner. The graph analytics appliance includes a router, a worklist scheduler, a processing unit, and an input/output unit. The router receives an abstraction program including a plurality of parallel algorithms for a query request from an abstraction program compiler residing on computational node or the graph analytics appliance. The worklist scheduler generates a prioritized plurality of parallel threads for executing the query request from the plurality of parallel algorithms. The processing unit executes multiple threads selected from the prioritized plurality of parallel threads. The input/output unit communicates with a graph database.

Method and apparatus for efficient execution of concurrent processes on a multithreaded message passing system

In one aspect, a method of enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging is disclosed. Also provided is an arrangement for implementing the inventive method. In another aspect, a method and on-chip controller are disclosed for enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging. Also provided is an on-chip reliability/variability controller arrangement for implementing the inventive method. In yet another aspect, base semiconductor chips, each comprising a plurality of chiplets, are manufactured and tested. For a base semiconductor chip having at least one non-functional chiplet, at least one repair semiconductor chiplet is vertically stacked. A functional multi-chip assembly is formed, which provides the same functionality as a base semiconductor chip in which all chiplets are functional.

Semiconductor chip repair by stacking of a base semiconductor chip and a repair semiconductor chip

Enhanced modularity in heterogeneous three-dimensional computer processing chip stacks includes a method of manufacture. The method includes preparing a host layer and integrating the host layer with at least one other layer in the stack. The host layer is prepared by forming cavities on the host layer for receiving chips pre-configured with heterogeneous properties relative to each other, disposing the chips in corresponding cavities on the host layer, and joining the chips to respective surfaces of the cavities thereby forming an element having a smooth surface with respect to the host layer and the chips.

In one aspect, a method of enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging is disclosed. Also provided is an arrangement for implementing the inventive method. In another aspect, a method and on-chip controller are disclosed for enhancing semiconductor chip process variability and lifetime reliability through a three-dimensional (3D) integration applied to electronic packaging. Also provided is an on-chip reliability/variability controller arrangement for implementing the inventive method. In yet another aspect, base semiconductor chips, each comprising a plurality of chiplets, are manufactured and tested. For a base semiconductor chip having at least one non-functional chiplet, at least one repair semiconductor chiplet chiplet is vertically stacked. A functional multi-chip assembly is formed, which provides the same functionality as a base semiconductor chip in which all chiplets are functional.

A semiconductor chip includes a plurality of multi-core clusters each including a plurality of cores and a cluster controller unit. Each cluster controller unit is configured to control thread assignment within the multi-core cluster to which it belongs. The cluster controller unit monitors various parameters measured in the plurality of cores within the multi-core cluster to estimate the computational demand of each thread that runs in the cores. The cluster controller unit may reassign the threads within the multi-core cluster based on the estimated computational demand of the threads and transmit a signal to an upper-level software manager that controls the thread assignment across the semiconductor chip. When an acceptable solution to thread assignment cannot be achieved by shuffling of threads within the multi-core cluster, the cluster controller unit may also report inability to solve thread assignment to the upper-level software manager to request a system level solution.

Low overhead dynamic thermal management in many-core cluster architecture

Growing community of inventors

Cortlandt Manor, NY, United States of America

Jude A Rivers