Ge Aviation Systems Limited

Judd Everett Swanson

Richard Anthony Eddins

Michel Engelhardt

Liqiang Yang

Christopher James Kapusta

Brian Magann Rush

David Richard Esler

Liang Yin

Paul Otto Stehlik

Arun Virupaksha Gowda

Darrell Lee Grimes

Christopher Mouris Astefanous

Shung Ik Lee

A modular POL component can be arranged to define a half-bridge converter topology, and can be coupled with other modular POL power components to define a full-bridge or 3-phase AC converter topology based on a desired power output. The assembled POL components can be mounted on a common electrically insulative substrate to define a POL power conversion device to provide the desired power output.

Modular power overlay device and method

The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.

Electronic connection assembly

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Liquid-cooled assembly and method

A heat sink assembly for use with at least one heat-emitting component where the heat sink assembly includes a first phase change material conductively coupled to the at least one heat-emitting component and changing phase at a first temperature and a second phase change material conductively coupled to the first phase change material and changing phase at a second temperature, which is greater than the first temperature.

Heat sink assemblies for transient cooling

A circular heatsink can include a thermally conductive cylinder with an outer circumferential surface and an inner circumferential surface. An emissive and convective and convective surface area can extend radially from the outer circumferential surface. At least one thermally conductive ledge can extend from the inner circumferential surface and be configured to support a planar substrate having heat-generating electrical components. Air flow over the emissive and convective surface area can cause thermal conduction away from the heat-generating electrical components and through the at least one thermally conductive ledge, the thermally conductive cylinder, and the emissive and convective surface area.

Growing community of inventors

Plantation, FL, United States of America

Judd Everett Swanson