Fitesa (china) Airlaid Company Limited

Other

Ppg Industries Ohio, Inc.

Fitesa Simpsonville, Inc.

Fitesa Simponsville, Inc.

Juan Wang

Marc Newman

Jichun Ren

Xunwang Feng

Yijian Qu

David R Fenn

Wei Wang

Wei Wei

Shengli Wang

Stephen Brian Istivan

Yuling Liu

Craig D Niederst

Weiwei Li

Chinming Hui

Xinhuan Niu

Liming Song

Zhenguo Ma

Hai Rong Huang

Iei Xie

Xiaojie Meng

Wenqing Liu

Provided is a composite sheet that is particularly useful as an AQDL component in absorbent articles. The composite sheet includes a fluid acquisition component and an airlaid component. The airlaid component may include one or more airlaid layers that are successively formed overlying each other. Each of the airlaid layers are adjacent to, and in direct contact with, immediately adjacent layers of the airlaid component so that adjacent layers are in fluid communication with respect to each other. The fluid acquisition component includes a nonwoven fabric comprising a carded nonwoven fabric comprised of a plurality of staple fibers that are air through bonded to each other to form a coherent nonwoven fabric. The airlaid layer(s) include a blend of cellulose and non-cellulose staple fibers. The staple fibers may be bicomponent fibers having a polyethyelene sheath and a polypropylene or polyethylene terephthalate core, and mixtures of such fibers.

Airlaid composite sheet material and method

Airlaid composite sheet material

The present invention provides waterborne curable film-forming compositions comprising:

Waterborne compositions and compact processes of forming multi-component composite coating compositions on substrates

Taught is a method of removal surface contaminants, including organic contaminants, metal ions and solid particles, from silicon wafer surface comprising the following steps: (a) submerging the silicon wafer surface in an aqueous cleaning agent solution through which current is passed using a boron-doped diamond film as an electrode; (b) submerging the silicon wafer surface in an aqueous cleaning agent solution; subjecting the silicon wafer to ultrasound waves; and, optionally, heating the solution; (c) submerging the silicon wafer surface in water through which current is passed using a boron-doped diamond film as an electrode; (d) submerging the silicon wafer surface in water with ultrasound and heating; (e) repeating step (d); and (f) spraying the silicon surface with water. The results obtained using the method according to this invention are far superior to those obtained with conventional methods. The technology is simple, convenient to operate, and environmentally friendly.

Method for removing contaminants from silicon wafer surface

Growing community of inventors

Tianjin, China

Juan Wang