Infineon Technologies Austria Ag

Infineon Technologies Ag

Juan Sanchez

Gerald Deboy

Eslam Abdelhamid

Matthias J Kasper

Petteri Palm

Kennith Kin Leong

Giuseppe Bernacchia

Martin Henning Vielemeyer

Mahadi-Ul Hassan

Thomas Gebhard

Sebastian Uitz

A pre-packaged chip includes a chip having at least one electrical top contact at a top side of the chip and at least one electrical bottom contact at a bottom side, a first laminate layer on the top side, a second laminate layer on the bottom side, the first laminate layer and the second laminate layer being laminated together to sandwich the chip therebetween, a first metal layer on the first laminate layer and electrically contacted to the at least one electrical top contact via at least one top contact hole through the first laminate layer, and a second metal layer on the second laminate layer and electrically contacted to the at least one electrical bottom contact via at least one bottom contact hole through the second laminate layer. The pre-packaged chip is free from any contact hole extending from the first metal layer to the second metal layer.

Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package

A multi-level converter comprises one or more flying capacitors configured to operate at balanced voltages. The multi-level converter comprises a plurality of switching groups comprising pairs of switches operable to transfer energy to and from an inductor and the one or more flying capacitors for inverting an input voltage to an inverted output voltage. The multi-level converter comprises the inductor configured to operate according to an inductor frequency greater than a switching frequency used to control the plurality of switching groups.

Multi-level inverting buck-boost converter architecture

According to some embodiments, an apparatus comprises a multi-level power converter configured to convert an input voltage to an output voltage, wherein the multi-level power converter comprises one or more switching groups, wherein a switching group of the one or more switching groups comprises a pair of switches and a flying capacitor, and a controller configured to determine a duty reference for the switching group, determine a duty correction factor for the switching group based upon a flying capacitor voltage error of the flying capacitor, determine a sign correction signal based on a flying capacitor ripple voltage, and determine a duty command for activating the pair of switches based on the duty reference, the duty correction factor, and the sign correction signal.

Multi-level power converter architecture

According to one configuration, a power system includes a resonant power converter, a monitor resource, and a controller. During operation, the resonant power converter converts an input voltage to an output voltage. The monitor resource monitors a magnitude of the input voltage. The controller dynamically controls a corresponding resonant frequency of the resonant power converter and a switching frequency of switches in the resonant power converter depending on a magnitude of the input voltage.

Dynamic regulation resonant power converter

In accordance with an embodiment of the present invention, a method of controlling current through a transistor includes measuring a voltage across the transistor, measuring a current through the transistor, determining a safe operating current for the measured voltage across the transistor, and adjusting a voltage of a control node of the transistor using a feedback controller until the measured current through the transistor is not greater than the determined safe operating current.

Growing community of inventors

Villach, Austria

Juan Sanchez