Adesto Technologies Corporation

Axon Technologies Corporation

Juan Pablo Saenz Echeverry

Deepak Kamalanathan

Shane Charles Hollmer

John Dinh

Venkatesh P Gopinath

Foroozan Sarah Koushan

Derric Lewis

Michael N Kozicki

Nad Edward Gilbert

Daniel Wang

John Ross Jameson

Janet Wang

Vasudevan Gopalakrishnan

In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse.

Resistive memory device with ramp-up/ramp-down program/erase pulse

A memory device can include a plurality of two terminal conductive bridging random access memory (CBRAM) type memory elements; at least one program transistor configured to enable a program current to flow through at least one memory element in response to the application of a program signal at its control terminal and a program bias voltage to the memory element; and an erase load circuit that includes at least one two-terminal diode-like load element, the erase load circuit configured to enable an erase current to flow through the load element and at least one memory element in a direction opposite to that of the program current.

Circuits and methods for placing programmable impedance memory elements in high impedance states

Method of operating a resistive memory device with a ramp-up/ramp-down program/erase pulse

Structures and methods for control of an operating window of a programmable impedance element are disclosed herein. In one embodiment, a semiconductor memory device can include: (i) a memory array having a programmable impedance element; (ii) a register configured to be programmed with data that represents an erase verify value, a program verify value, and a read trip point resistance value, for the memory array; (iii) a controller configured to determine a mode of operation for the memory array; (iv) a register access circuit configured to read the register to obtain data that corresponds to the mode of operation; and (v) a voltage generator configured to generate a reference voltage based on the register data, where the reference voltage is used to perform an operation on the programmable impedance element corresponding to the mode of operation.

Programmable window of operation for CBRAM

A memory cell includes a first resistive switching device having a first terminal and a second terminal, a switching device having a first terminal and a second terminal, and an access device having a first access terminal and a second access terminal. The first access terminal is coupled to the first terminal of the first resistive switching device and the first terminal of the switching device.

Resistive switching memories

A memory device can include a plurality of programmable impedance elements programmable between a low impedance state in response to a program voltage and a higher impedance state in response to an erase voltage having a different polarity than the program voltage; a programming circuit configured to apply the program and erase voltages to selected elements; and a pre-condition path configured to apply a pre-condition voltage only of the erase voltage polarity to fresh elements in a pre-condition operation; wherein fresh elements are elements that have not been subject to any programming voltages. The pre-condition electrical conditions can also include high voltage low current conditions that apply a greater magnitude voltage and smaller current than the first or second electrical conditions, or high voltage low current conditions that apply a greater magnitude voltage and greater current than the first or second electrical conditions.

Pre-conditioning circuits and methods for programmable impedance elements in memory devices

Structures and methods for recovering data in a semiconductor memory device are disclosed herein. In one embodiment, a method of recovering data in a semiconductor memory device, can include: (i) pre-conditioning a first memory cell on the semiconductor memory device by using a formation voltage to program a first data state in the first memory cell; (ii) storing a second data state in a second memory cell on the semiconductor memory device by maintaining the second memory cell in a virgin state; (iii) mounting the semiconductor memory device on a printed-circuit board (PCB) by using a high temperature process that increases a resistance of the first memory cell; and (iv) performing a recovery of the first data state by reducing the resistance of the first memory cell.

Safeguarding data through an SMT process

A memory device can include a load circuit coupled in series with at least one memory element between two nodes and configured to enable a programming current to flow through the memory element to lower its impedance, and configured to enable an erase current to flow through the element in a direction opposite to the program current, the erase current varying in response to an erase voltage applied across the two nodes as the memory element impedance increases.

Structures and methods for controlling operation of a programmable impedance element are disclosed herein. In one embodiment, a method of controlling a programmable impedance element can include: (i) receiving a program or erase command to be executed on the programmable impedance element; (ii) selecting an operation algorithm for executing the command, where the operation algorithm is selected from among a plurality of operation algorithms by decoding at least two bits stored in a register; (iii) determining, using the register, a plurality of option variables for the selected operation algorithm, where the option variables are used to set conditions for one or more of a plurality of program and erase operations of the selected operation algorithm; and (iv) executing the command on the programmable impedance element by performing the one or more of the plurality of program and erase operations of the selected operation algorithm.

Growing community of inventors

Mountain View, CA, United States of America

Juan Pablo Saenz Echeverry