Rivian IP Holdings, LLC

Juan Lopez

Young Mok Doo

Shawn Warren Merritt

Silva Hiti

Disclosed embodiments include alignment apparatuses for circuit boards, inverter assemblies, and methods for fabricating an assembly with a circuit board placed on an alignment apparatus. An illustrative apparatus includes an electrically insulative substrate having a first substantially planar surface and a second substantially planar surface forming an opposing side of the first substantially planar surface. The second substantially planar surface defines therein self-aligning features that are configured to align at least one power module pin with the electrically insulative substrate. The first substantially planar surface has at least one alignment feature configured to align a printed circuit board with the electrically insulative substrate. The apparatus also includes a routing feature coupled to the electrically insulative substrate. The routing feature is configured to route at least one low voltage conductor.

Inverter insulator apparatus and method

Various disclosed embodiments include illustrative inverter modules that are integratably mountable with a drive unit of a vehicle, illustrative drive units with an inverter module integratably mounted therewith, and illustrative vehicles with at least one drive unit with an inverter module integratably mounted therewith. Given by way of non-limiting example, an illustrative module for a drive unit of a vehicle includes a housing having an open face defined therein. Inverter circuitry is disposed in the housing.

Growing community of inventors

Wildomar, CA, United States of America

Juan Lopez