Stmicroelectronics S.a.

Juan Exposito

Remi Brechignac

Kevin Channon

Julien Vittu

Rémi Brechignac

Laurent Herard

Andrea Cigada

An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semiconductor component, and includes a window allowing light to pass through it toward the optical sensor. An optical lens () is disposed in the cavity () between the optical sensor () and the window (). A support structure () supports the optical lens. This optical semiconductor module may also include a shield ().

Optical semiconductor package with incorporated lens and shielding

A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

Device for mounting a semiconductor package on a support plate via a base

Optical semiconductor package and its fabrication process, in which: a rear face of a first semiconductor component () such as a microprocessor is supported by a front face of an electrical connection support plate (); a rear face of a second semiconductor component () is fixed to a front face of the said first component () and a front face of this second component has an optical sensor (); first electrical connection means () connect the said first component to the front face of the said support plate; second electrical connection means () connect the said second component to the front face of the said support plate; means () ensure encapsulation of the said components stacked on the said support plate and of the said electrical connection means, the said encapsulation means being made from a transparent material which is opposite the said optical sensor; and external electrical connection means () are located on an exposed part of the said support plate.

Optical semiconductor housing and method for making same

A process is provided for fabricating an optical semiconductor package. According to the process, a first semiconductor component is fixed to a rear face of an electrical connection support plate, and this first component is electrically connected to the support plate. An encapsulation block for the first component is molded on the rear face of the support plate. A second semiconductor component, a front face of which has an optical sensor, is fixed to one face of the first component, and this second component is electrically connected to the support plate. The second component is encapsulated on the front face of the support plate. Also provided is an optical semiconductor package.

Optical semiconductor package and process for fabricating the same

An optical semiconductor package includes an optical semiconductor component (), a front face of which has an optical sensor (), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection () of this optical semiconductor component (). The encapsulation () includes a glass pane letting light through to the optical sensor. The encapsulation () includes electromagnetic screening () made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component ().

Shielded housing for optical semiconductor component

A method is provided for packaging an integrated circuit chip that has a front face with sensors located in a central region and electrical connection areas located in a region that lies between at least one edge of the chip and the central region. According to the method, a rear face of the chip is cemented to a front face of a substrate that includes through-holes, with the rear face of the substrate including electrical connection areas that pass in front of the through-holes such that the through-holes are located laterally with respect to the edge of the chip. The electrical connection areas on the front face of the chip are connected to the electrical connection areas on the substrate through the through-holes, and the chip is embedded in an optically transparent encapsulating material so as to form an encapsulating block on the same side as the front face of the substrate. The substrate is cut around the encapsulating block, following the perimeter of the encapsulating block. Also provided is a semiconductor package that includes an integrated circuit chip, a substrate, electrical connectors, and an encapsulating material.

Process for packaging a chip with sensors and semiconductor package containing such a chip

A process for manufacturing semiconductor packages comprising, respectively, a substrate, a chip which forms an integrated circuit and is attached to one region of the substrate, electrical connection means connecting the chip to a group of external electrical connection regions lying on one face of the substrate, as well as an encapsulation encasement. The process consists in producing, in a matrix configuration, a multiplicity of groups of connection regions (104a) on a common substrate plate (102), corresponding to as many chip attachment regions (109), in attaching a chip (103) to each attachment region (109) of the common substrate plate, in electrically connecting each chip (103) to the associated electrical connection regions (104a), so as to obtain an assembly (111) consisting of the substrate plate and the connected chips. The process consists, in a second step, in placing this assembly (111) in a mold (112) and in injecting an encasement material (106) into the mold so as to obtain, in a single molding operation, a parallelepipedal block (117) and then, in a subsequent step, in cutting the said parallelepipedal block (117) through its thickness into units, each constituting a semiconductor package.

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St. Nazaire les Eymes, France

Juan Exposito