Signify Holding B.v.

Philips Lighting Holding B.v.

Koninklijke Philips Corporation N.V.

Fps Investments B.v.

Juan David Bernal

Vincent Stefan David Gielen

Reinier Imre Anton Den Boer

Merijn Keser

Kwan Nai Lee

The present invention relates to a heat transferring arrangement for cooling at least one light emitting diode, wherein the heat transferring arrangement comprises a centre portion configured for mounting the light emitting diode and adapted to receive heat generated from the light emitting diode when emitting light, and a plurality of elongated heat transferring elements, each having a first end portion connected to the centre portion and a second end portion which when inserted in a housing is configured to be in abutment with an inner surface of the housing, so that the generated heat is thermally transferred to the housing. Advantages with the invention includes, at least, that a passive heat transferring arrangement is provided which may reduce the need of an external fan or membranes to provide sufficient cooling.

Heat transferring arrangement

The present invention relates to a heat transferring arrangement () for cooling at least one light emitting diode (), wherein the heat transferring arrangement () comprises a centre portion () configured for mounting the light emitting diode () and adapted to receive heat generated from the light emitting diode () when emitting light, and a plurality of elongated heat transferring elements (), each having a first end portion () connected to the center portion () and a second end portion () which when inserted in a housing () is configured to be in abutment with an inner surface () of the housing (), so that the generated heat is thermally transferred to the housing (). Advantages with the invention includes, at least, that a passive heat transferring arrangement is provided which may reduce the need of an external fan or membranes to provide sufficient cooling.

Growing community of inventors

Eindhoven, Netherlands

Juan David Bernal