Texas Instruments Corporation

Agere Systems Inc.

Agere Systems Guardian Corp.

Texas Instruments Incorporated Deutschland, Gmbh

Ciclon Semiconductor Device Corp.

Juan Alejandro Herbsommer

Benjamin Stassen Cook

Adam Joseph Fruehling

Baher S Haroun

Robert Floyd Payne

Osvaldo Jorge Lopez

Argyrios Dellis

Jonathan Almeria Noquil

Gerd Schuppener

Swaminathan Sankaran

Simon Joshua Jacobs

Bichoy Bahr

Hassan Omar Ali

Bradley Allen Kramer

Matthew David Romig

Marie Denison

Brian Ashley Carpenter

Timothy Brooks Bambridge

David Jauregui

Rajen Manicon Murugan

Steven Alfred Kummerl

Django Trombley

Marco Corsi

Mark William Morgan

Yiqi Tang

Abram M Castro

Vikas I Gupta

Wei-Yan Shih

Rongwei Zhang

Hugo Fernando Safar

Eunyoung Seok

Meysam Moallem

Yong Lin

Jeffery John Gilbert

Osvaldo J Lopez

Joel Lott

George John Libricz, Jr

Lutz Albrecht Naumann

James Francis Hallas

Randy Long

Jeffrey Michael Klemovage

Lucian Hriscu

Athena Lin

Nikita Mahjabeen

Yiu-Huen Wong

Kurt Peter Wachtler

Bradley Paul Barber

Peter Ledel Gammel

Ali Djabbari

Paul Merle Emerson

Thomas Herbert Shilling

Ralf Jakobskrueger Muenster

Phillip Nadeau

Mark E Granahan

George J Przybylek

Khanh C Nguyen

Yigi Tang

S Josh Jacobs

Django Earl Trombley

In a described example, an apparatus includes a first substrate having a first side, a second side, and a coupling interface across a portion of the first side. The coupling interface including an arrangement of subwavelength periodic structures formed in the first substrate. A second substrate is coupled to a portion of the second side of the first substrate to form a sealed cavity aligned with the coupling interface.

Coupling interfaces for waveguide structures and methods of fabrication

A device comprises a U-shaped cell configured to contain a quantum gas, a first waveguide coupled to an inlet of the U-shaped cell, and a second waveguide coupled to an outlet of the U-shaped cell. The device also comprises a multi-layer substrate including transmitter and receiver antennas that are aligned with the first and second waveguides, respectively, the substrate including a network of metal layers coupled to the transmitter and receiver antennas. The device also includes transmitter and receiver dies coupled to the transmitter and receiver antennas, respectively, by way of the network of metal layers, the substrate positioned between the U-shaped cell and the transmitter and receiver dies.

Millimeter wave quantum sensor device

A described example includes an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.

Microelectronic device package including antenna and semiconductor device

In one example, a system includes a first sealed container, a second sealed container, a signal coupler, a container enclosure, and an electromagnetic (EM) reflective coating. The first sealed container encloses a first dipolar gas. The second sealed container encloses a second dipolar gas. The signal coupler is communicatively coupled between the first and second sealed containers. The signal coupler includes a solid material or a hollow sealed tube. The container enclosure encloses the first and second sealed containers and the signal coupler. The EM reflective coating is inside the container enclosure and covers at least part of the first container, at least part of the second container, and at least part of the signal coupler.

Quantum-based device including vapor cell

In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.

Package for millimeter wave molecular clock

A described example includes: a semiconductor die mounted to a die pad of a package substrate, the semiconductor die having bond pads on a device side surface facing away from the die pad; bond wires coupling the bond pads of the semiconductor die to leads of the package substrate, the leads spaced from the die pad; an antenna positioned over the device side surface of the semiconductor die and having a feed line coupled between the antenna and a device side surface of the semiconductor die; and mold compound covering the semiconductor die, the bond wires, a portion of the leads, and the die side surface of the die pad, a portion of the antenna exposed from the mold compound.

Microelectronic device package with integrated antenna

A described example includes: an antenna formed in a first conductor layer on a device side surface of a multilayer package substrate, the multilayer package substrate including conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers, the multilayer package substrate having a board side surface opposite the device side surface; and a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the antenna.

An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.

Interposer between an integrated circuit antenna interface and an external waveguide interface including an internal waveguide coupled between these interfaces

In a clock apparatus, a signal waveguide includes: a gas cell having a sealed interior; and a dipolar gas inside the sealed interior. A first apparatus is configured to provide a first electromagnetic wave through the sealed interior along a first direction. A second apparatus is configured to provide a second electromagnetic wave through the sealed interior along a second direction, in which the second direction is opposite the first direction. Also, the clock apparatus includes receiving apparatus coupled to the signal waveguide and configured to detect an amount of energy in the second electromagnetic wave passing through the dipolar gas.

Molecular atomic clock with wave propagating rotational spectroscopy cell

A physics cell includes a sealed glass vial that contains a high-purity dipolar gas (e.g., OCS) at a low pressure (e.g., between about 0.01 millibar and 0.2 millibar). The vial can be sealed using a laser cutting process that involves only local heating of the vial that does not denature the bulk of the contained gas. One or more electromagnetically translucent windows or vial-end access points provide access to electromagnetic waves launched or received by one or more electromagnetic antennas at a frequency that is adjusted to match the quantum transition frequency of the gas based on a detected maximum absorption frequency. The glass-vial physics cell can be fabricated at lower cost than physics cells fabricated from bonded wafers. Multiple vials can be joined by a waveguide in an enclosure so that launch and receive antennas can be provided at a single end of the vials.

Hermetic vial for quantum transitions detection in electronic devices applications

A compact mmW spectroscopy cell system for detecting volatile organic compounds (compounds) in a gas. The system includes a gas collection chamber, an input buffer cavity for receiving the gas from the gas collection chamber, pumping devices to pass the gas from the buffer cavity to an absorption cell and maintain pressure, and a transceiver connected to the cell. The transceiver interrogates the absorption cell filled with the gas by passing a high frequency electromagnetic signal and sweeping the signal to generate an absorption spectra which is compared to a spectroscopy database for detecting the compounds in the gas. The absorption cell, collection chambers, and pumping devices are fabricated with standard CMOS processing techniques at chip and wafer scale. The transceiver bonded to the absorption cell with chip scale integration.

Integrated compact mmW spectroscopy cell system and method

A millimeter wave apparatus, with a substrate, a transceiver in a first fixed position relative to the substrate, and a gas cell in a second fixed position relative to the substrate. The clock apparatus also comprises at least four waveguides.

Compact millimeter wave system

A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

Packaged electronic device and multilevel lead frame coupler

In described examples, a magnetic sensor includes a waveguide that encapsulates dipolar molecules. A mm-wave electromagnetic field is launched into the waveguide, travels through the dipolar molecules, and is then received after passing through the dipolar molecules. The frequency of the mm-wave electromagnetic signal is swept across a range that includes an intrinsic quantum rotational state transition frequency (Fr) for the dipolar molecules. Absorption peaks in accordance with the Zeeman effect are determined. A strength of a magnetic field affecting the magnetic sensor is proportional to a difference in the frequencies of the absorption peaks.

Millimeter wave magnetic sensor

Growing community of inventors

Allen, TX, United States of America

Juan Alejandro Herbsommer