Dow Silicones Corporation

Dow Corning Corporation

Dow Corning Toray Company, Ltd.

Dow Toray Co., Ltd.

Ju Young Yook

Makoto Yoshitake

Haruna Yamazaki

Gunn Jo

Jina Chon

A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements is disclosed. The composition comprises: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, optionally, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.

Curable organopolysiloxane composition and optical semiconductor device

A photocurable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: RRSiOwhere Ris an alkenyl group having from 2 to 12 carbons, Ris an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of Rare the aryl groups or the aralkyl groups; and 'a' and 'b' are positive numbers satisfying: 1&#x2264;(a+b)&#x2264;2.5 and 0.001&#x2264;a/(a+b)&#x2264;0.2; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a compound having at least two thiol groups in a molecule; (D) a photoradical initiator having a phosphorus atom; and (E) a hindered phenol compound.

Photocurable silicone composition and cured product thereof

This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition

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Chungcheongbuk-do, South Korea

Ju Young Yook