Samsung Electronics Co., Ltd.

Ju-Youn Choi

Seung-Yong Cha

Yun-Hee Lee

Eun-Seok Song

Kyoung Lim Suk

Wonjae Lee

A semiconductor package including: a package substrate; an interposer on the package substrate; a chip stack on the interposer, the chip stack including a plurality of first semiconductor chips that are stacked in a first direction; a second semiconductor chip on the interposer and spaced apart from the chip stack in a second direction intersecting the first direction; and a first signal pad, a second signal pad, and a power/ground pad on a top surface of the interposer, wherein the chip stack is mounted on the first signal pad, wherein the second semiconductor chip is mounted on the second signal pad, wherein the chip stack and the second semiconductor chip are connected to the power/ground pad, and wherein the power/ground pad overlaps a portion of the chip stack and a portion of the second semiconductor chip.

Semiconductor package

An electronic device package includes a package substrate, an interposer located above the package substrate and electrically connected to the package substrate, a processing device located above the interposer and electrically connected to the interposer, at least one high bandwidth memory device located above the interposer and electrically connected to the interposer and the processing device, a power management integrated circuit device located above the interposer and electrically connected to the interposer and the processing device, and a passive device located on or inside the interposer and electrically connected to the power management integrated circuit device.

Growing community of inventors

Hwaseong-si, South Korea

Ju-Youn Choi