National Starch and Chemical Investment Holding Corporation

Henkel Ag & Company, Kgaa

Essex Specialty Products Inc.

Henkel US IP Lcc

Ju-Ming Hung

Yue S Zhang

Wayne K Chu

James W Nowicki

Rose Ann Schultz

Qiwei He

Kenneth Edward Martin

Michael G Harwell

Tahir Iqbal

Peter J Schlom

Brian S Huffman

Sam Louis Samuels

Paul P Puletti

Ingrid Cole

Zhixin Li

Wei Kong

George A Hespe

Martin Riswick

Yimin Zhang

High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.

Moisture cured reactive hot melt adhesive with monofunctional reactants as grafting agents

High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Reactive hot melt adhesive with improved hydrolysis resistance

Low application temperature thermoplastic hot melt adhesives are particularly useful as elastic attachment adhesives. The adhesives have a viscosity at 275&#xb0; F. of less than about 8,000 cp, a yield stress of less than about than 80 psi and a creep performance for a bond made through strand coating of less than about 15%. Preferred are adhesives that have a creep performance for a bond made through spiral coating of less than about 25%.

Low application temperature elastic attachment adhesive

Adhesives comprising up to about 40 wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.

Ionomer-containing hot melt adhesive

The present invention is directed to nitrile-oxide precursor compounds, and their preparation and use as an irreversible cross-linking agent in polymers having appropriate functionality, i.e., alkenes, alkynes nitriles, and isocyanates. The present invention is also directed to the use of nitrile oxide compound in filled or unfilled applications such as pressure sensitive adhesives, reactive hot melts, polyurethane dispersions, thermosetting adhesives, thermoplastic adhesives or coatings.

Reagents for heat activated polymer crosslinking

High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with one or more difunctionals having cyclic or polycyclic structures.

Reactive hot melt adhesive with improved properties

Reactive hot melt adhesive with non-polymeric aromatic difunctionals

The present invention is directed to nitrile-oxide precursor compounds, and their preparation and use as an irreversible cross-linking agent in polymers having appropriate functionality, i.e., alkenes, alkynes nitrites, and isocyanates. The present invention is also directed to the use of nitrile oxide compound in filled or unfilled applications such as pressure sensitive adhesives, reactive hot melts, polyurethane dispersions, thermosetting adhesives, thermoplastic adhesives or coatings.

A solvent-free one-part hot melt polyurethane adhesive or sealant composition which is solid at room temperature comprising 10 to 70% by weight of a urethane prepolymer having an isocyanate content of 0.25 to 15% and an isocyanate index greater than 1 and 30 to 90% by weight of an ethylenically unsaturated polymer having a number average molecular weight of 4,000 to 15,000 as determined by Gel Permeation Chromatography using a PL Gel,Mixed 10 micron column, a Shimadzu Model RID 6A Detector with a tetrahydrofuran carrier solvent at a flow rate of 1 milliliter per minute, the polymer containing sufficient hydroxyl functionality to provide an OH number of 5 to 15.

Polyurethane hotmelt adhesives with reactive acrylic copolymers

A process for foaming polyurethane reactive hot melt adhesive comprising the steps of:

Reactive hot melt foam

Disclosed herein is a one-part adhesive which comprises a mixture of: (a) a polymerizable ethylenically unsaturated urethane polymer; and (b) a polymerizable ethylenically unsaturated acid, acid salt, or acid anhydride wherein component (b) is present in an amount in the range of from about 0.5 weight percent to about 50 weight percent of component (a). Such an adhesive is especially suitable for bonding components together in the manufacture of automobiles, and is particularly suitable for bonding sheet molding compound (SMC) components to metal or to other SMC components.

Growing community of inventors

Yardley, PA, United States of America

Ju-Ming Hung