Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Anam Semiconductor Inc.

Ju Hoon Yoon

Jin Young Kim

Sung Kyu Kim

Se Woong Cha

Yoon Joo Kim

No Sun Park

Seung Jae Lee

Ji Young Chung

Robert Francis Darveaux

Miguel Angel Jimarez

Choon Heung Lee

Ki Wook Lee

Jae Dong Kim

Dae Keun Park

Michael Barrow

Glenn A Rinne

Doo Hyun Park

Jin Seong Kim

Seong Min Seo

Dong Joo Park

Tae Yong Lee

Jae Min Bae

Jae Yun Kim

Jin Young Khim

Do Hyun Na

Gi Tae Lim

Gyu Wan Han

Byong Woo Cho

Woon Kab Jung

Ho Jeong Lim

Kwang Woong Ahn

Won Sun Shin

Byung Joon Han

In Gyu Han

Sung Bum Kwak

Byong Jin Kim

Gi Jeong Kim

Min Ho Kim

Won Bae Bang

Jae Sung Park

Choong Hoe Kim

Yang Gyoo Jung

Chan Ha Hwang

Dong Su Ryu

Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.

Semiconductor device using EMC wafer support system and fabricating method thereof

A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.

Semiconductor device and manufacturing method thereof

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Electronic device package and fabricating method thereof

A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 &#x3bc;m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

In one embodiment, a method for fabricating a semiconductor package includes providing a multi-layer molded conductive structure. The multi-layer molded conductive structure includes a first conductive structure disposed on a surface of a carrier and a first encapsulant covering at least portions of the first conductive structure while other portions are exposed in the first encapsulant. A second conductive structure is disposed on the first encapsulant and electrically connected to the first conductive structure. A second encapsulant covers a first portion of the second conductive structure while a second portion of the second conductive structure is exposed to the outside, and a third portion of the second conductive structure is exposed in a receiving space disposed in the second encapsulant. The method includes electrically connecting a semiconductor die to the second conductive structure and in some embodiments removing the carrier.

Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure

Growing community of inventors

Namyangju-si, South Korea

Ju Hoon Yoon