Hitachi Global Storage Technologies Netherlands B.v.

Apple Inc.

Hgst Netherlands, B.v.

University of Washington

Jr-Yi Shen

Andre Sirilutporn Chan

Joshua G Nickel

Steven Alf Hanssen

Jifang Tian

Kunihiro Shida

Ferdinand Hendriks

Fu-Ying Huang

Ta-Chang Fu

Zhi Ning Wang

Stanley Yen Wong

Edgar Dennis Rothenberg

Michael R Hatchett

Mattia Pascolini

Kirk Barrows Price

John Martin Burns

Robert Carl Reinhart

Andrew Keith Hanlon

Jen-Yuan Chang

Robert P Harshberger, Jr

Andre Sirilutporn

Christopher A Gimenez

Tisha Jefferson

John Thomas Contreras

Matthew A Mow

Luiz M Franca-Neto

Harish Rajagopalan

Jayesh Nath

James B Sullivan

Charles Allan Brown

Takaaki Deguchi

Hitoshi Shindo

Peter I Bevelacqua

Anand Lakshmanan

Manoj Keshavan

Masakazu Sasaki

Vishwanath Venkataraman

James L McPeak

Chisin Chiang

I-Yeu Shen

Ruska Patton

Antony Nguyen

Chaw-Wu Tseng

Jeffrey Kerner

Masaki Kohno

Charles E Hignite

Khaled M Fawzi

Clayton Paul Henderson

Gregory Joseph Arnone

Rocky Mai

Hung H Quach

Ricardo German Duque

Jeffery Kerner

Lynn Liebschutz

Xin Cui

Emmanuel N Tatarakis

Jia-Woei Chen

Sammer Al-Robaee

Sze Yang Dennis Ng

A testing system may include a test electronic device having a test antenna disposed in a first signal path of a first antenna array of an electronic device. The test antenna may receive a first signal from the first antenna array. The testing system may also include a reflector disposed in a second signal path of a second antenna array of the electronic device. The reflector may reflect a second signal from the second antenna array to the test antenna. The reflector may include a flat, parabolic, or elliptical curvature that reflects a radio frequency signal emitted by the second antenna array to the test antenna.

Systems and methods for testing multiple mmWave antennas

A testing apparatus for electromagnetically sensitive equipment includes a housing defining a testing chamber. The housing blocks transmission of electromagnetic waves from an external environment into the testing chamber and reduces reflection of electromagnetic waves within the testing chamber. The testing apparatus also includes a tube defining an air flow path between the testing chamber and the external environment. The tube blocks transmission of electromagnetic waves from the external environment into the air flow path. The tube includes a proximal end coupled to an opening in the housing such that the air flow path is fluidly coupled to the testing chamber via the opening, a distal end opposing the proximal end, and a bent segment extending between the proximal end and the distal end.

Electromagnetic shielded testing chamber with ventilation

A test station may include a test host, a test unit, and a test enclosure. A device under test (DUT) having at least first and second antennas may be placed in the test enclosure during production testing. Radio-frequency test signals may be conveyed from the test unit to the DUT using a test antenna in the test enclosure. In a first time period during which the performance of the first antenna is being tested, the DUT may be oriented in a first position such that path loss between the first antenna and the test antenna is minimized. In a second time period during which the performance of the second antenna is being tested, the DUT may be oriented in a second position such that path loss between the second antenna and the test antenna is minimized. The DUT is marked as a passing DUT if gathered test data is satisfactory.

Methods for reducing path loss while testing wireless electronic devices with multiple antennas

Electronic devices may be tested using a test station with a test fixture. The test fixture may include a first holding structure in which a device under test may be placed and a second holding structure for supporting test probes. The second holding structure may be mated with a test probe alignment structure during test station setup operations. The test probe alignment structure may include registration features configured to set the relative position of the first and second holding structures to a known configuration and may include test probe alignment features that can be used to correctly position the placement of the test probes. If at least one of the test probes is not sufficiently aligned to its corresponding alignment feature, the test probe alignment structures will not be able to engage properly with the second holding structure, and the position of the problematic test probe may be adjusted accordingly.

Test probe alignment structures for radio-frequency test systems

Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a capacitive coupling probe. The probe may have electrodes. The electrodes may be formed from patterned metal structures in a dielectric substrate. A test unit may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the electrodes. Complex impedance data, forward transfer coefficient data, or other data may be used to determine whether the structures are faulty. A fixture may be used to hold the capacitive coupling probe in place against the conductive electronic device structures during testing.

Testing system with capacitively coupled probe for evaluating electronic device structures

A wireless electronic device may contain at least one adjustable antenna tuning element for use in tuning the operating frequency range of the device. The antenna tuning element may include radio-frequency switches, continuously/semi-continuously adjustable components such as tunable resistors, inductors, and capacitors, and other load circuits that provide desired impedance characteristics. A test system that is used for performing passive radio-frequency (RF) testing on antenna tuning elements in partially assembled devices is provided. The test system may include an RF tester and a test host. The tester may be used to gather scattering parameter measurements from the antenna tuning element. The test host may be used to ensure that power and appropriate control signals are being supplied to the antenna tuning element so that the antenna tuning element is placed in desired tuning states during testing.

Methods and apparatus for performing passive antenna testing with active antenna tuning device control

A clamping device for coupling a rotatable component of a machine with a shaft, including a balance hole configured to confine a counterweight. The clamping device includes a circular plate. The circular plate includes at least one fastener hole configured to accept a fastener, and at least one balance hole. The fastener is configured to fasten the clamping device to couple the component with the shaft. The balance hole includes a cavity configured to accept a counterweight. The counterweight is configured to balance the rotational motion of at least the circular plate when the shaft is rotated. Moreover, the cavity is configured to confine the counterweight to an end of the cavity by effects of rotation of the shaft on the counterweight when the shaft is rotated.

Clamping device for a rotatable component of a machine including a balance hole configured to confine a counterweight

Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a pair of pins or other contacts. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the test probe contacts. An antenna may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the conductive electronic device structures contain a fault.

Testing system with electrically coupled and wirelessly coupled probes

Avoiding contaminant generation within a hard disk drive due to increased temperatures during a solder reflow process is described. Energy from a beam of energy that is directed toward a plurality of polyimide regions is received. Each of the plurality of polyimide regions are disposed adjacent to at least one solder pad. The plurality of polyimide regions and the at least one solder pad comprises a first component of a hard disk drive. Then, a portion of the energy is reflected away from the plurality of polyimide regions to prevent an absorption of the portion by the plurality of polyimide regions and a burning of the plurality of polyimide regions.

Reducing a generation of contaminants during a solder reflow process

A particle-capturing device. The particle-capturing device includes a component having a surface that is configured to be disposed inside an enclosure, and is configured to make contact with an air-stream carrying particles within the enclosure. The component includes an electrostatic particle-capturing portion that includes a dielectric electrically insulating portion, and a plurality of charged portions. The charged portions are embedded in the dielectric electrically insulating portion, and are configured to generate an electrostatic field coupled with the surface that captures the particles from a flow of the air-stream and confines the particles at the surface. In addition, the component is configured to provide at least one additional function within the enclosure exclusive of capturing particles.

Particle-capturing device including a component configured to provide an additional function within an enclosure exclusive of capturing particles

A flex cable assembly for a head stack assembly of a hard disk drive comprises a flex cable for conducting data signals from the head stack assembly to a connector. The flex cable comprises a dynamic loop section between a termination for the head stack assembly and the connector. A constrained layer damper is attached adjacently to an area of the flex cable that is configured to receive the coupler. The constrained layer damper extends into the dynamic loop section of the flex cable.

Flex cable assembly damper

A flex circuit comprises a base film, a first adhesive layer coupled with the base film, at least two signal traces coupled with the first adhesive layer, and at least one dummy trace positioned between the two signal traces and coupled with the first adhesive layer. The flex circuit comprises a second adhesive layer coupled with the signal traces, the dummy trace, and the first adhesive layer, and a cover film coupled with the second adhesive layer.

Flex circuit assembly with a dummy trace between two signal traces

A method of reducing oscillation at the read write element of a hard disk drive, is described. In one embodiment, a flex cable for conducting data signals from a head stack assembly to a connector is provided. One or more weights are then coupled with the flex cable at one or more predetermined locations. The one or more predetermined locations are selected based upon mass distribution along the flex cable.

Positioning weight assemblies along a dynamic loop section of a flex cable to reduce flex cable oscillation

A flex cable assembly for a head stack assembly of a hard disk drive comprises a flex cable for conducting data signals from the head stack assembly to a connector. The flex cable has a dynamic loop section between a termination for the head stack assembly and the connector. The flex cable has a constrained layer damper for attenuating random transient vibration. The constrained layer damper has a symmetrically tapered shape for reducing stress concentration and is coupled with the dynamic loop section of the flex cable adjacent to an area of the flex cable configured for receiving a coupler for coupling the flex cable assembly with the head stack assembly.

Symmetrically tapered constrained layer damper for a flex cable assembly for a hard disk drive

A post-assembly head/disk offset adjuster is disclosed. One embodiment provides a housing and at least one disk coupled with the housing. In addition, an adjustable pivot plate is coupled with the housing such that access to at least one adjustment point of the adjustable pivot plate is provided regardless of a state of assembly of the hard disk drive. Furthermore, an actuator is coupled with the adjustable pivot plate. In so doing, an adjustment to the at least one adjustment point of the adjustable pivot plate results in an adjustment to the actuator regardless of the state of assembly of the hard disk drive.

Post-assembly head/disk offset adjuster

Growing community of inventors

Sunnyvale, CA, United States of America

Jr-Yi Shen