Siemens Aktiengesellschaft

Siemens Production & Logistics Systems Ag

Interuniversitair Micro-electronica Centrum, Vzw

Siemens N.v.

Jozef Van Puymbroeck

Marcel Heerman

Hubert De Steur

Eric Beyne

Eddy Roelants

Jean Joseph Roggen

Luc Boone

Joost Wille

Rita Van Hoof

Marcel Heermann

For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: 

Method and device for laser drilling organic materials

A method and device for the laser drilling of laminates includes the use of a frequency-doubled Nd vanadate laser. The laser includes the following parameters: pulse width<40 ns, pulse frequency&gE;30 kHz for the metal layer and &gE;20 kHz for the dielectric layer, and wavelength&equals;532 nmn. Such a laser is used for the laser drilling of laminates which have at least one metal layer and at least one dielectric layer including an organic material.

Method and device for laser drilling laminates

A method for producing printed circuit boards having coarse conductor structures and at least one region having fine conductor structures. The coarse conductor structures and the fine conductor structures are etched out of a metal layer in a common etching process. An etching resist patterned by means of photolithography is used in the region of the coarse conductor structures, and an etching resist patterned with the aid of a laser beam is used in the region of the fine conductor structures.

Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures

A metal layer, an etching resist and a photoresist are successively applied to an electrically insulating substrate. Whereupon the photoresist is patterned by photolithography in such a way that it covers a pattern of the later coarse conductor structures and the entire region of the later fine conductor structures. After the uncovered etching resist has been stripped, the photoresist is removed, whereupon the etching resist is patterned with the aid of a laser beam in such a way that it has the pattern of the fine conductor structures. The coarse conductor structures and the fine conductor structures are then formed in a common etching process.

Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures

The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S ) is given a slanted, roof-shaped or convex contour (K ) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S ), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K ) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S ).

Wiring arrangements having electrically conductive cross connections and method for producing same

Polymer stud grid array

Growing community of inventors

Oostkamp, Belgium

Jozef Van Puymbroeck