N.v. Raychem S.a.

Jozef F Van Beersel

Yvo F Leest

Robin C John

Paul G Peigneur

A tape covering for elongate substrates such as metal pipes is provided. At least one edge of the tape is chamfered. and in preferred embodiments the angle of the chamfer is no greater than 25.degree. especially no greater than 7.degree.. In other preferred embodiments the tape comprises a backing layer and an adhesive layer, both of which preferably include a chamfered edge, the chamfer preferably extending through both the backing layer and the adhesive layer. The tape is preferably heat recoverable, and the adhesive, if present, heat activatable. The tape may be installed according to a preferred method of the invention using induction heating, preferably at such high frequency that the ratio of the thickness of the substrate to the skin depth is at least 25:1.

Method for protecting substrates

Article and method for protecting substrates

Method for applying covering material to an elongate substrate

A heat-recoverable wrap-around sleeve for pipe protection, with a patch-type closure. The patch is heat-stable and comprises two polymeric layers bonded together through, for example, an open mesh glass-fibre fabric. No separate adhesive is required. The hot modulus of one of the layers is low enough to enable it to bond to the overlapping edges of the wrap-around sleeve, and the hot modulus of the other layer is high enough to withstand installation temperature. This new patch is easier to install and requires less materials than prior art patches, and does not need to be bonded to the sleeve in such a distinct heating step.

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Temse, Belgium

Jozef F Van Beersel