Medtronic, Inc.

Kyocera Corporation

Joyce Yamamoto

Gordon Orvis Munns

Andrew Jason Thom

Thomas P Miltich

Markus W Reiterer

Arne Knudsen

Hidekazu Otomaru

Hiroshi Makino

Kengo Morioka

Shingo Satou

Gregory John Haubrich

Keiichi Fujii

Brad Conrad Tischendorf

William John Taylor

Nicholas C Wine

Yanzhu Zhao

James D Reinke

John Louis Sommer

Kenneth C Gardeski

Larry Earl Tyler

Simon E Goldman

Shawn D Knowles

Michael William Barror

Joseph M D'Sa

Jeffrey O York

Jeremy W Burdon

Rajesh V Iyer

Mark D Breyen

David Nghiem

David B Engmark

Greg Haubrich

Daniel J Koch

William D Verhoef

Len D Twetan

Quentin Scott Denzene

Robert S Wentink

Gerard J Hill

Charles S Farlow

Michael E Nowak

Gerardo Aguirre

Takahito Hirata

Tom Miltich

Duane N Mateychuk

William Michael Brosnan

Roger L Hubing

Andy Thom

William M Brosnan

A hermetic feedthrough for an implantable medical device includes a sheet having a hole defined therethrough, wherein the sheet comprises a first material that is an electrically insulative ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole so as to form a conduit, the second material having platinum and an additive that includes alumina. The second material does not include SiO, MgO, or CaO. The first and second materials have a co-fired bond therebetween, the co-fired bond hermetically sealing the hole.

Hermetic feedthrough for an implantable medical device

A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.

Electrical leads for a feedthrough

An implantable medical device (IMD) and methods of fabricating the same are provided. An IMD can include a housing and a cofire ceramic module (CCM) coupled to the housing. The CCM can include an antenna cofire-integrated in the CCM. The antenna can include a plate composed of conductive material, and conductive antenna elements that are annular substrates having perimeters substantially coextensive with the perimeter of the plate. The antenna can also include interconnections. A first set of interconnections can be coupled between the plate and one of the conductive antenna elements, and a second set of interconnections can be coupled between the conductive antenna elements. The antenna can also include a feed line conductively coupled to the plate. In some embodiments, the feed line can be substantially serpentine-shaped to adjust impedance in the CCM.

Implantable medical devices having cofire ceramic modules and methods of fabricating the same

A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.

Method of manufacturing a feedthrough

An antenna for an implantable medical device (IMD) is provided that is formed on the same substrate as the telemetry circuitry for the IMD. The telemetry circuitry is formed on a portion of the substrate within the interior of a housing for the IMD, while at least one antenna is formed on an exterior portion of the substrate on the exterior of the housing to allow for far field telemetry. At least one electrical interconnect is formed on the substrate for connecting the antenna to the telemetry circuitry, where the electrical interconnect may comprise a controlled impedance line to minimize loss. A conformally-shaped hermetic cover, such as a ceramic material, may be formed in a desired shape around the exterior portion of the substrate and antenna and cofired together to form a monolithic structure encasing the antenna and exterior portion of the substrate.

Antenna for implantable medical devices formed on extension of RF circuit substrate and method for forming the same

An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first end being open to provide access to the hollow cavity and the second end being closed. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Implantable medical devices having hollow cap cofire ceramic structures and methods of fabricating the same

An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first and second ends being open to provide access to the hollow cavity. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Implantable medical devices having hollow sleeve cofire ceramic structures and methods of fabricating the same

A hermetic feedthrough for an implantable medical device includes an insulator body and a ferrule. The insulator body includes ceramic material and one or more electrically conductive conduits extending through the insulator body. The insulator is disposed in an opening of the ferrule. The insulator body includes a plurality of substantially flat surfaces that each include a plurality of edges. A rounded corner extends between adjacent edges of any two adjacent substantially flat surfaces. Each corner between any two adjacent substantially flat surfaces that face toward the ferrule has an average radius that is less than approximately 25% of a length of the corresponding edges.

Insulator for a feedthrough

An antenna for an implantable medical device (IMD) is provided including a monolithic structure derived from a plurality of discrete dielectric layers having an antenna embedded within the plurality of dielectric layers. The antenna includes antenna portions formed within different layers of the monolithic structure with at least one conductive via formed to extend through the dielectric layers in order to provide a conductive pathway between the portions of the antenna formed on different layers, such that an antenna is formed that extends between different vertical layers. The dielectric layers may comprise layers of ceramic material that can be co-fired together with the antenna to form a hermetically sealed monolithic antenna structure. The antenna embedded within the monolithic structure can be arranged to have a substantially spiral, helical, fractal, meandering or planer serpentine spiral shape.

Co-fired multi-layer antenna for implantable medical devices and method for forming the same

A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

Hermetic feedthrough

A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.

A co-fired electrical feedthrough for an implantable medical device (IMD) is provided having a shielded radio frequency (RF) conductive path. The feedthrough includes a monolithic structure derived from one or more layers of dielectric material and a conductive pathway extending through the monolithic structure for communicating RF signals into and from the IMD. An internal shield is formed to extend through at least one of the layers of dielectric material so as to surround the conductive pathway (e.g., in a coaxial relationship) and shield the RF conductive pathway from undesirable signals. This shielding of the RF conductive pathway prevents destructive EMI signals from entering into the IMD through the RF conductive pathway. In some embodiments, a monolithic structure containing embedded impedance matching elements is electrically connected to at least one conductive pathway in the feedthrough to perform impedance matching and/or filtering of the conductive pathway to other circuitry.

Co-fired electrical feedthroughs for implantable medical devices having a shielded RF conductive path and impedance matching

Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

Multi-electrode implantable systems and assemblies therefor

An implantable medical device ('IMD') is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.

External RF telemetry module for implantable medical devices

Growing community of inventors

Maple Grove, MN, United States of America

Joyce Yamamoto