Sandia Corporation

New York University

Government of the United States of America, As Represented by the Secretary of Commerce

Joy M Barker

David G Grier

Darwin K Serkland

Randolph R Kay

Seethambal S Mani

Kosta Ladavac

Thomas M Gurrieri

Dahwey Chu

David V Campbell

Subhash L Shinde

Jeffrey L Rienstra

Michael L Holmes

A modular, scalable focal plane array is provided as an array of integrated circuit dice, wherein each die includes a given amount of modular pixel array circuitry. The array of dice effectively multiplies the amount of modular pixel array circuitry to produce a larger pixel array without increasing die size. Desired pixel pitch across the enlarged pixel array is preserved by forming die stacks with each pixel array circuitry die stacked on a separate die that contains the corresponding signal processing circuitry. Techniques for die stack interconnections and die stack placement are implemented to ensure that the desired pixel pitch is preserved across the enlarged pixel array.

Focal plane array with modular pixel array components for scalability

A system and method for bonding and unbonding of small objects using small adhesive particles. The system and method includes the use of a plurality of optical tweezers to manipulate objects to be bonded and adhesive particles suspended in a fluid. The objects to be bonded (or unbonded) and the adhesive particles are positioned by lower power optical tweezers and then an intense bonding optical tweezer is activated to cause the adhesive to join the objects together (or used to unbond objects).

System and method for holographic optic trap bonding

Growing community of inventors

Albuquerque, NM, United States of America

Joy M Barker