Samsung Electronics Co., Ltd.

Joung-Rhang Lee

Jong-Soo Choi

Yong-Hyun Kim

Chang-Yong Park

Byung-Man Kim

Sei-Gu Lee

A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap unit at the same time it is applied to pads of the printed circuit board and, for example, by performing high temperature reflow. In addition, reliability and reduction in cost of a pin connector can be ensured without using a pin connector into which a high-priced wired solder is inserted. Rather a general pin connector can be used because the pin connector and the tap unit are connected to each other through the solidified solder formed on the tap unit.

Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board

A test coupon for measuring a dielectric constant of a memory module substrate has a plurality of test pattern layers each having a long trace and a short trace formed thereon. A first test pattern layer has an exposed surface and a second test pattern layer is formed internally. The first test pattern layer has probe pads respectively connected to the long and short traces of the first and second pattern layers. Probe pads of the first test pattern layer are connected to a via contact of the second test pattern layer by via holes. The via contact of the second pattern layer is connected to the long and short traces of the second pattern layer. The test coupon is used to measure the dielectric constant of a module board.

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Seoul, South Korea

Joung-Rhang Lee