Hewlett-packard Development Company, L.p.

3m Innovative Properties Company

Intelligent Energy Inc.

Joshua W Smith

Joel Arthur Gerber

Brian E Schreiber

Yu Chen

Chien-Hua Chen

Ronald A Hellekson

Laurie S Mittelstadt

Gary J Watts

Siddhartha Bhowmik

David M Craig

William R Boucher

Swaroop K Kommera

David M Braun

Christopher C Aschoff

Richard J Oram

Phillip G Rourke

Philip G Rourke

Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.

Print head die slot ribs

A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Die carrier with fluid chamber

A method for roughening a surface of an ion exchange system structure using laser interaction with a surface. The laser surface roughening process allows the use of a wide range of substrates such as metals, ceramics, silicates, polymers and the like, including varieties which can not be fabricated in a fine fibrous structure. The surface roughened ion exchange system structure may be used as an ion-exchange media in applications such as fuel cells, batteries, and other catalysis systems where a high surface exchange area is desirable.

Ion exchange system structure with a microtextured surface, method of manufacture, and method of use thereof

Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.

Circuit elements using z-axis interconnect

Method for making circuit elements for a z-axis interconnect

Growing community of inventors

Corvallis, OR, United States of America

Joshua W Smith