National Technology & Engineering Solutions of Sandia, LLC

Virginia Tech Intellectual Properties, Inc.

Joshua Stewart

Rolando Burgos

Jason C Neely

Jack David Flicker

Jarod James Delhotal

Dong Dong

Dushan Boroyevich

Robert W Brocato

Robert Kaplar

Jun Wang

Lee Joshua Rashkin

Yue Xu

Lakshmi Ravi

James Richards

Geoff L Brennecka

Riley Spear

Jennifer Cotter

Scott Jarnagin

Lance Hood

A cleaning utensil is disclosed; the utensil may have a core and bristle holders for holding bristle assemblies; the cleaning utensil may be in the shape of a trigonal pyramid.

Bottle-cleaning utensil and method of use

Disclosed is a drill attachment device comprising a transfer gear configured to rotate about an axis perpendicular to the axis of a drill used to power the transfer gear. The transfer gear may comprise an open-ended slot which provides a passageway through which a threaded rod may pass. The open-ended slot may further be configured to retain a mechanical nut, enabling a user to run a threaded rod through the open-ended slot for driving the nut along the rod. The transfer gear may also support an external driver, and the drill attachment device may comprise guide slots configured to position the rod and/or nut against the external driver for driving a nut up or down rod.

Drill attachment

Various embodiments of laminated planar bus structures that minimize electromagnetic interference (EMI) and parasitic inductance are described. In one embodiment, a laminated planar bus structure may include a plurality of stacked conductive layers and a plurality of stacked insulation layers. The plurality of stacked conductive layers may include positive and negative conductive layers, and conductive ground layers stacked as outer layers as to enclose vertically the positive and the negative conductive layers. In another embodiment, the laminated planar bus structure may include a middle ground layer stacked in between the positive and the negative conductive layers to provide additional reduction in electric field strength. A laminated planar bus structure that is integrated with other power electronics components is also presented.

Low impedance multi-conductor layered bus structure with shielding

An inverter with a modular bus assembly is described. In various embodiments, the modular bus assembly includes a laminated motherboard and a plurality of capacitor daughtercards. The laminated motherboard can be configured to interface a plurality of phase-leg modules and a plurality of capacitor daughtercards through a plurality of terminals and connectors located on a bottom side or a top side of the laminated motherboard. The laminated motherboard includes a layer stack with a plurality of conductor layers. Each of the plurality of conductor layers is implemented with a net spacing from a neighboring plated through hole (PTH) based at least in part on differences in potential to be applied to each of the plurality of conductor layers as compared to a potential to be applied to the PTH. Embedded shield polygons can be implemented on the laminated motherboard to mitigate surface discharge at surface terminal (PTH/SMT) triple junctions.

Medium voltage planar DC bus distributed capacitor array

A hybrid switched capacitor power converter for high-power applications is provided. The converter has a transistor-switched input-stage boost converter followed by a capacitor-and-diode ladder circuit. The converter is adapted to produce an output voltage of at least 5 kV at a power level of at least 0.5 kW. The ladder circuit includes one or more multi-stage rails.

Passive high-power-density grid interface device

A DC power bus having reduced parasitic inductance and higher tolerable operating temperature is disclosed. In example embodiments, a bus structure overlies a printed circuit board, and an array of capacitors is arranged on a surface of the printed circuit board distal the bus structure. The bus structure comprises an upper metal plate, a lower metal plate, and a dielectric film interposed between the upper and lower metal plates. The capacitors are connected in parallel between conductive planes of the printed circuit board. The upper and lower metal plates of the bus structure are connected to respective conductive planes of the printed circuit board.

Low-inductance direct current power bus

Growing community of inventors

Blacksburg, VA, United States of America

Joshua Stewart