Finisar Corporation

Joshua Moore

Stephen T Nelson

Greta Light

Lucy G Hosking

Frank J Flens

Daehwan Daniel Kim

Hung V Nguyen

Rafik Ward

Cindy Hsin-I Hsieh

Donald Arthur Ice

Chris Togami

Gary D Sasser

YongShan Zhang

Sunil Priyadarshi

Charles Steven Joiner

Communication devices are disclosed. In an example embodiment, a communication device may include a communication module including an illumination source and a body element. The body element may be configured to allow illumination generated by the illumination source to propagate within and illuminate at least a portion of an outer surface of the body element.

Communication devices including an illumination source and a physical input sensor

Communication devices including a sensor configured to detect physical input

An identification device is configured to be coupled externally to an optoelectronic device to provide connectivity and/or identification information in an optical network in which the optoelectronic device is implemented. The identification device may include an integrated circuit with unique identification information and a plurality of contacts coupled to the integrated circuit and configured to be coupled to an outside identification system. The outside identification system communicates with the identification device via the plurality of contacts to collect unique identification information, the ability to retrieve the unique identification information additionally implicating connectivity in some embodiments. The identification device may include a plurality of clips configured to engage corresponding posts on a latch of the optoelectronic device.

Intelligent bail

In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like.

Rotatable top shell

Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

Optical subassembly grounding in an optoelectronic module

A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules.

Spider clip for securing a circuit board within a communications module

A printed circuit board assembly (PCBA) carrier for enclosing an optical transceiver PCBA. The PCBA carrier includes a base portion including one or more first connection members, the base portion being configured to receive an optical transceiver PCBA and a top portion including one or more second connection members configured to couple to the first connection members to thereby secure the top portion to the base portion, the top portion being configured to reside above the optical transceiver PCBA when the first and second connection members are coupled. The PCBA carrier is further configured to enclose the optical transceiver PCBA when the base and top portions are coupled to provide a solid structure for the optical transceiver PCBA without the need for a separate optical transceiver module housing.

Printed circuit board assembly carrier for an optical electrical device

In one example embodiment, an angular seam includes a first complementary structure defined in a first shell of an optoelectronic transceiver module, and a second complementary structure defined in a second shell of the optoelectronic transceiver module. The second complementary structure is configured to receive the first complementary structure so that an angular seam is defined that is substantially non-transmissive to electromagnetic radiation.

Angular seam for an electronic module

Electrical connections from the printed circuit board ('PCB') of an optoelectronic device through the front or line-side of the device enable a microcontroller or other component on the PCB to electrically communicate with an optical connector or other line-side device. The electrical connections can be integrated within a lead frame and trace structure providing mechanical support for the electrical connections and the PCB, with each electrical connection including a PCB-side contact and a line-side contact supported by the integrated structure. Alternately, the electrical connections can be integrated within one or more flex circuits. The optical connector can include traces and contacts configured to be electrically coupled to corresponding line-side contacts when the optical connector is received within the device.

Line-side out-of-band electrical interface for optoelectronic modules

A gasketed collar for reducing EMI emission from a communication module is presented. The gasketed collar includes a conductive metal collar designed to fit at least partway around the communication module, and a gasket. The gasket is electrically conductive and compressible. The gasket fits at least partway around the communication module and overlaps the conductive metal collar. A communication module including such gasketed collar and a method of making such communication module are also presented.

Gasketed collar for reducing electromagnetic interference (EMI) emission from optical communication module

Mechanisms and systems for dissipating heat from an optical transceiver module to a module card cage system. In one embodiment, a thermal conductive label having at least one raised portion is attached to a surface of the module. The raised portion is configured to contact at least a portion of the card cage to dissipate heat from the module to the card cage. In another embodiment, the card cage has a protruding depression formed on a part of its surface that is above a slot configured to receive an optical transceiver module. The protruding depression is configured to contact at least a portion of the module to dissipate heat from the module to the card cage.

Mechanisms for heat transfer in an optical transceiver module and card cage system

An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.

Monolithic shell for an optical electrical device

A latching system for use in selectively securing a module within a receptacle of a host device is described. In one or more examples, the latching system includes a powered actuation mechanism and a latching mechanism. In one or more examples, the module latching mechanism includes a latch and the powered actuation mechanism disengages a latch from a catch. In one or more examples, two latches are provided. In one or more examples, the latching mechanism of a module includes a pusher that interacts with a latch located on a receptacle. In one or more examples, a module includes two latches.

Growing community of inventors

Sunnyvale, CA, United States of America

Joshua Moore