Tokyo Electron Limited

Joshua Hooge

Michael Carcasi

Mark H Somervell

Benjamen M Rathsack

Joel Estrella

Anton J deVillers

Steven A Scheer

Seiji Nagahara

Lior Huli

Ihsan Simms

Masahide Tadokoro

Ronald W Nasman

Ian J Brown

Wallace Paul Printz

Rodney Lee Robison

Hiroshi Marumoto

Antonio Luis Pacheco Rotondaro

James Grootegoed

Norman A Jacobson, Jr

David Travis

Jeffrey Smith

Kousuke Yoshihara

Masashi Enomoto

Yuichi Terashita

Teruhiko Kodama

Carlos A Fonseca

Katsunori Ichino

Nathan Ip

Derek Bassett

Yuichiro Kunugimoto

David Hetzer

Hiroyuki Iwaki

Steven Scheer

An exemplary method of monitoring a bath process includes processing a first wafer by submerging the first wafer within a bath solution; capturing a video of the bath solution containing the first wafer during a first time interval; analyzing the video based on intensity of light captured in a frame of the video; and based on analyzing the video, determining a first metric of the bath solution during the first time interval.

Wafer bath imaging

A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

Bath systems and methods thereof

The disclosure herein describes methods for Photosensitized Chemically Amplified Resist Chemicals (PS-CAR) to pattern light sensitive films (e.g., photoresist on anti-reflective coatings) on a semiconductor substrate. In one embodiment, a two-step exposure process may generate higher acid concentration regions within a photoresist layer. The PS-CAR chemicals may include photoacid generators (PAGs) and photosensitizer elements that enhance the decomposition of the PAGs into acid. The first exposure may be a patterned EUV or UV exposure that generates an initial amount of acid and photosensitizer. The second exposure may be a non-EUV flood exposure that excites the photosensitizer which increases the acid generation rate where the photosensitizer is located in the film stack. The distribution of energy during the exposures may be optimized by using certain characteristics (e.g., thickness, index of refraction, doping) of the photoresist layer, an underlying layer, and/or an overlying layer.

Chemical amplification methods and techniques for developable bottom anti-reflective coatings and dyed implant resists

Embodiments are described herein to monitor and synchronize dispense systems for processing systems. For one embodiment, pressure and flow rate sensors are used to determine a delay between a flow change event and an increase in flow rate, and this delay is used to detect defects or conditions within the dispense system. For one embodiment, dispense system operation is synchronized using flow rate sensors. For one embodiment, simulation models or complex dispense profiles based upon combined pressure/flow/spin/concentration sensor data are used to enable complex process recipes. For one embodiment, dispense-to-dispense pressure and/or flow rate measurements are used to detect dispense parameters and defects. For one embodiment, cameras and image processing are used to detect flow rates from the dispense nozzle, and dispense-to-dispense measurements are used to detect dispense parameters and defects. One or more of the disclosed embodiments can be used in processing systems for microelectronic workpieces.

Methods and systems to monitor, control, and synchronize dispense systems

Camera images may be utilized to detect substrate edges and provide information regarding the centering of the substrate within the fluid dispense system. Camera images may also be utilized to monitoring the location of a cup within the fluid dispense system. The signal processing techniques utilized may include data smoothing, analyzing only certain wavelengths of reflected energy, transforming the data (in one embodiment utilizing a Fourier transform), and/or analyzing a sub-set of the collected pixels of data. The camera image data collected herein may be combined with a wide variety of other data so as to better monitor, characterize and/or control a substrate processing process flow.

Systems and methods for spin process video analysis during substrate processing

Embodiments of systems and methods for monitoring one or more characteristics of a substrate are disclosed. Various embodiments of utilizing optical sensors (in one embodiment a camera) to provide data regarding characteristics of a fluid dispensed upon the substrate are described. A variety of hardware improvements and methods are provided to improve the collection and analysis of the sensor data. More specifically, a wide variety of hardware related techniques may be utilized, either in combination or singularly, to improve the collection of data using the optical sensor. These hardware techniques may include improvements to the light source, improvements to the optical sensors, the relationship of the physical orientation of the light source to the optical sensor, the selection of certain pixels of the image for analysis, and the relationship of the optical sensor frame rate with the rotational speed of the substrate.

Hardware improvements and methods for the analysis of a spinning reflective substrates

A substrate inspection system is provided to monitor characteristics of a substrate, while the substrate is disposed within (or being transferred into/out of) a processing unit of a liquid dispense substrate processing system. The inspection system is integrated within a liquid dispense substrate processing system and includes one or more optical sensors of a reflectometer (such as a spectrometer or laser-based transceiver) configured to obtain spectral data from a substrate. A controller is coupled to receive the spectral data from the optical sensors(s). The one or more optical sensors (or one or more optical fibers coupled to the rest of the optical sensor hardware) are coupled at locations within the substrate processing system. The controller analyzes the spectral data received from the optical sensors(s) to detect characteristic(s) of the substrate including, but not limited to, film thickness (FT), refractive index changes, and associated critical dimension (CD) changes.

Systems and methods for monitoring one or more characteristics of a substrate

Camera images are utilized to provide information regarding characteristics of in a fluid dispense system. Camera images may be utilized to identify the movement of the hardware of a fluid dispense system. The movement of the hardware may be utilized to determine the beginning of a fluid dispense based upon a correlation between the hardware movement and a dispense time provided in a dispense recipe. The beginning of the fluid dispense may be detected by performing an image analysis on the camera images to detect the presence of the fluid in the camera image. The image analysis may involve an intensity analysis of the detected camera image. In another embodiment, the camera image is utilized to detect the edges of the fluid formed on substrate. The edges may be detected as a puddle formed prior to spinning the substrate and/or may be detected as the puddle spreads during spinning.

Systems and methods for automated video analysis detection techniques for substrate process

Various embodiments of systems and methods for drain line monitoring are disclosed herein. More specifically, a liquid dispense unit for a coating/developing processing system is provided herein for applying one or more liquid solutions to a substrate disposed within the liquid dispense unit. In the disclosed embodiments, a pH sensor and/or a line particle counter (LPC) is coupled to a drain line of the liquid dispense unit to monitor various parameters of the liquid waste, which is ejected from the substrate and disposed of through the drain line. In some embodiments, measurements obtained from the pH sensor may be used to optimize a develop process by detecting an endpoint of the develop process, avoiding pH shock and/or detecting excursions in the develop process. In some embodiments, measurements obtained from the LPC may additionally or alternatively be used to optimize the develop process.

Systems and methods for developer drain line monitoring

Disclosed herein is a technology related to the amelioration (e.g., correction) of global wafer distortion based on a determination of localized distortions of a semiconductor wafer. Herein, a distortion is either an out-of-plane distortion (OPD) or in-plane distortion (IPD). The reference plane for this distortion is based on the plane shared by the surface of a presumptively flat semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Amelioration of global wafer distortion based on determination of localized distortions of a semiconductor wafer

The disclosure herein describes methods for Photosensitized Chemically Amplified Resist Chemicals (PS-CAR) to pattern light sensitive films on a semiconductor substrate. In one embodiment, a two-step exposure process may generate higher acid concentration regions within a photoresist layer. The PS-CAR chemicals may include photoacid generators (PAGs) and photosensitizer elements that enhance the decomposition of the PAGs into acid. The first exposure may be a patterned EUV exposure that generates an initial amount of acid and photosensitizer. The second exposure may be a non-EUV flood exposure that excites the photosensitizer which increases the acid generation rate where the photosensitizer is located on the substrate. The distribution of energy during the exposures may be optimized by using certain characteristics (e.g., thickness, index of refraction, doping) of the photoresist layer, an underlying layer, and/or an overlying layer.

Methods and techniques to use with photosensitized chemically amplified resist chemicals and processes

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.

High-purity dispense system

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.

Growing community of inventors

Austin, TX, United States of America

Joshua Hooge