Intel Corporation

Other

Joshua Heppner

Gaurav Chawla

Eric Jin Li

Shawna M Liff

Rajendra C Dias

Vijaykumar Krithivasan

Jeffory L Smalley

Adel A Elsherbini

Mitul Bharat Modi

Srikant Nekkanty

Anna M Prakash

Michael Garcia

Zhichao Zhang

Yoshihiro Tomita

David J Llapitan

Sasha N Oster

Kemal Aygun

Javier A Falcon

Debendra Mallik

Nachiket R Raravikar

Rajasekaran Swaminathan

Sriram Srinivasan

Kuang C Liu

Gregorio R Murtagian

Glen Patrick Gordon

Reynaldo Alberto Olmedo

Venmathy McMahan

Sarah M Canny

Dhanya Athreya

Ann Jinyan Xu

Sriya Sanyal

Johanna M Swan

Aleksandar Aleksov

Robert L Sankman

Srinivas V Pietambaram

Sanka Ganesan

Kaladhar Radhakrishnan

Ram S Viswanath

Dilan Seneviratne

Donald Tiendung Tran

Pramod Malatkar

Sergio Antonio Chan Arguedas

Jimin Yao

Brent S Stone

Nadine L Dabby

Jonathan W Thibado

Abdul M Bailey

Takashi Kumamoto

Neal E Ulen

Roderick E Kronschnabel

Chris D Lucero

Rajat Goyal

Michael J Baker

Kevin Lowell Hudson

Albert S Lopez

Zuyang Liang

Shipeng Qiu

Gary M Barnes

Khine N Han

Nayandeep K Mahanta

Daniel Chavez-Clemente

Katherine Perkins

Naida Duranovic

Aniekeme Udofia

Hadi Sharifi

Son V Nguyen

Christopher Rossi

David B Lampner

Tomita Yoshihiro

Yoko Sekihara

Yoshishiro Tomita

Serge Roux

Kayleen L Helms

Neha Purushothaman

Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.

Ultra small molded module integrated with die by module-on-wafer assembly

An Internet of Things (IoT) apparatus including a plurality of boards and one or more connectors to couple IoT modules to one or more of the plurality of boards and to couple the plurality of boards to each other. The connectors include stacking connectors on both sides of at least some of the boards and at least some of the IoT modules to be coupled to the boards.

Modular system for internet of things and method of assembling the same

A support base for a training aid assembly includes opposing longitudinal support bars and first and second raised lips that extend between the opposing longitudinal support bars at a opposing end portions of the support base. An intermediate raised member extends between the opposing longitudinal support bars at an intermediate portion of the support base between the opposing end portions.

Training aid support base and assembly

Semiconductor packages with electromagnetic interference (EMI) shielding structures and a method of manufacture therefor is disclosed. In some aspects, a shielding structure can serve as an enclosure formed by conductive material or by a mesh of such material that can be used to block electric fields emanating from one or more electronic components enclosed by the shielding structure at a global package level or local and/or compartment package level for semiconductor packages. In one embodiment, wire and/or ribbon bonding can be used to fabricate the shielding structure. For example, one or more wire and/or ribbon bonds can go from a connecting ground pad on one side of the package to a connecting ground pad on the other side of the package. This can be repeated multiple times at a pre-determined pitch necessary to meet the electrical requirements for shielding, e.g. less than or equal to approximately one half the wavelength of radiation generated by the electronic components being shielded.

Semiconductor package with electromagnetic interference shielding structures

A substrate retention plate system for holding a substrate for processing in an electronic device manufacturing process is described. The retention plate system includes a top plate and a bottom plate to sandwich a flexible substrate. Additionally, the top plate includes a number of cams to stretch the flexible substrate across the bottom plate.

Stretching retention plate for electronic assemblies

The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.

Flexible packaging for a wearable electronic device

Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate having a recess, an electronic component disposed in the recess and electrically coupled to the substrate, and an underfill material disposed in the recess between the electronic component and the substrate. Associated systems and methods are also disclosed.

Electronic device package with recessed substrate for underfill containment

Examples of an electronic package include a package assembly. The package assembly can include a substrate having a first substrate surface that includes a conductive layer attached to the first substrate surface. The package assembly includes a die communicatively coupled to the conductive layer and a contact block that includes a first contact surface on one end of the contact block, a second contact surface on an opposing side of the contact block, and a contact block wall extended therebetween. The contact block can include a conductive material. The first contact surface can be coupled to the package assembly with a joint extended partially up the contact block wall. The electronic package can further include an overmold covering portions of the substrate, conductive layer, and die. The second contact surface of the contact block can be exposed through the overmold.

Through-mold structures

Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include a substrate including electrical connection circuitry therein, grounding circuitry on, or at least partially in the substrate, the grounding circuitry at least partially exposed from a surface of the substrate, a die electrically connected to the connection circuitry and the grounding circuitry, the die on the substrate, and a conductive foil or conductive film surrounding the die, the conductive foil or conductive film electrically connected to the grounding circuitry.

Systems and methods for electromagnetic interference shielding

Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.

Complex cavity formation in molded packaging structures

Electronic device package technology is disclosed. In one example, an electronic device package can include a bottom surface and a side surface extending from the bottom surface. The side surface can be oriented at a non-perpendicular angle relative to the bottom surface. In another example, an electronic device package can include a top planar surface having a first area, a bottom planar surface having a second area, and a side surface extending between the top surface and the bottom surface. The second area can be larger than the first area. In yet another example, an electronic device package can include a substrate defining a plane, an electronic component disposed on the substrate, and a layer of material disposed about a lateral side of the electronic component. The layer of material can be oriented at an angle of less than 90 degrees relative to the plane.

Electronic device packages with conformal EMI shielding and related methods

Electromagnetically shielded electronic device technology is disclosed. In an example, a method of making an electronic device package can comprise providing a substrate having a conductor pad and an electronic component. The method can also comprise forming a conformal insulating layer on the substrate and electronic component. The conformal insulating layer conforms to the electronic component. The method can further comprise exposing the conductor pad. In addition, the method can comprise forming an electrically conductive electromagnetic interference (EMI) layer on the insulating layer and in contact with the conductor pad.

Electromagnetically shielded electronic devices and related systems and methods

Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Socket contact techniques and configurations

A solar cell assembly includes a bendable substrate and multiple solar cells to be mounted over different surfaces of an electronic device. The bendable substrate includes an electrical contact to couple to an electrical contact on one of the surfaces of the electronic device. Thus, the electronic device only needs an electrical connection on one surface, and the solar cell assembly can mount solar cells on multiple surfaces to couple to the one electrical connection.

Multi-surface solar cell packaging for self-powered electronic devices

Growing community of inventors

Chandler, AZ, United States of America

Joshua Heppner