International Business Machines Corporation

Joshua C Myers

Jose A Hejase

Junyan Tang

Daniel Mark Dreps

Pavel Roy Paladhi

Joseph Paul Kuczynski

Wiren Dale Becker

Samuel R Connor

Sungjun Chun

Anil Yuksel

A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.

Electromagnetic waveguiding through liquid cooling conduit

Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.

Vertically transitioning between substrate integrated waveguides (SIWs) within a multilayered printed circuit board (PCB)

A printed circuit board ('PCB') including a substrate integrated waveguide ('SIW') formed using two ground planes representing the top and bottom walls of the waveguide, tightly pitched ground vias to act as two side walls and two back walls, and a pair of monopole antennas placed at each end of the SIW acting as signal feeding/receiving structures is disclosed. The waveguide dominant mode cut off frequency is determined by the spacing between the two side walls. Within each monopole antenna pair, the first monopole antenna operates at a first frequency while the second monopole antenna operates at another frequency. For each monopole antenna pair, the first monopole antenna and the second monopole antenna are located in the SIW at a distance from the back wall optimal for each operating frequency.

PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication

A method and apparatus for attenuating crosstalk between dielectric waveguides is provided. A first dielectric waveguide is formed to carry a first frequency band. A first filter is embedded within the first dielectric waveguide to attenuate transmission of a second frequency band through the first dielectric waveguide. The filter comprises alternating sections of a first dielectric material and a second dielectric material having different dielectric constants. The length of each section of the first and second dielectric materials is equal to a quarter of the wavelength of the central frequency of the second frequency band. A second waveguide is formed to carry the second frequency band. A second filter is embedded in the second dielectric waveguide to attenuate transmission of the first frequency band through the second dielectric waveguide. A cladding is disposed between the first and second waveguides.

Embedded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures

Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.

Communication system having a multi-layer PCB including a dielectric waveguide layer with a core and cladding directly contacting ground planes

Reduction of crosstalk between dielectric waveguides using split ring resonators

Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide coupled at respective ends to coaxial vias. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core. The coaxial vias include a center conductor and an outer conductor (or shield) which extend through one or more layers of the PCB. One of the coaxial vias radiates electromagnetic signals into the dielectric waveguide at a first end of the core while the other coaxial via receives the radiated signals at a second end of the core.

Growing community of inventors

Austin, TX, United States of America

Joshua C Myers