Invensense, Inc.

Joshua C LeMaire

Aleksey Sergeyevich Khenkin

Kieran P Harney

Jerad M Lewis

Paul M Schreier

A microphone package is integrated with a built-in speaker driver. A microphone application-specific integrated circuit (ASIC) and the speaker driver can be directly coupled to an external application processor, eliminating a need for a codec and thus, reducing the size, cost, and/or complexity of a device. In one aspect, the speaker driver and the microphone ASIC are implemented as separate dice mounted on the package substrate. In another aspect, the speaker driver and the microphone ASIC are implemented as stacked die on the package substrate. In yet another aspect, the speaker driver and the microphone ASIC are implemented as a single die on the package substrate.

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San Francisco, CA, United States of America

Joshua C LeMaire