Applied Materials, Inc.

Tyco Electronics Corporation

Ionics, Inc.

Microbar Incorporated

Te Connectivity Germany Gmbh

Symyx Technologies, Inc.

Littlefuse, Inc.

Josh Harris Golden

Luis A Navarro

Timothy Weidman

Peter I Porshnev

Gerald A Krulik

Matthew Peter Galla

Stephen D Allen

Eric W McFarland

Helge Schmidt

Arulkumar P Shanmugasundram

Martin Devenney

Daniel Mark Giaquinta

Yaxin Wang

Myoungsoo Jeon

Hongbin Fang

Jay J Jung

Earl Danielson

Martyn A Matthiesen

Damodara M Poojary

Paul H Dick

Xin Di Wu

Casper Reaves

Gennadiy Sverdlov

Peter I Porshvev

Michael R Woolston

Cormac Kissane

Donald Myers

Kalyan Sista

Nikhil Krishnan

Mary Elizabeth Sullivan Malervy

Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm&#xb7;mm/m&#xb7;atm&#xb7;day at approximately 0% relative humidity and approximately 23&#xb0; C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.

Oxygen barrier compositions and related methods

The invention relates to an electrical contact element, an electrical contact arrangement and methods for manufacturing an electrical contact element and for reducing oxidization of a contact section of an electrical contact element. In order to avoid that the durability of the contact element and therefore of the contact arrangement is negatively influenced by growing oxide layers on contact surfaces, the contact element is provided with a cover layer with a chemical reducing agent that can be activated by frictional forces.

Electrical contact element with a cover layer having a chemical reducing agent, electrical contact arrangement and methods for manufacturing an electrical contact element and for reducing oxidization of a contact section of an electrical contact element

Electrical connector including a connector body having a mating side configured to interface with an electrical component. The electrical connector also includes signal pathways extending through the connector body. The signal pathways are arranged to form pairs of signal pathways. The electrical connector also includes an impedance-control assembly having a plurality of dielectric bodies supported by the connector body. The dielectric bodies surround respective pairs of signal pathways. The dielectric bodies include a dielectric medium and gas bubbles distributed in the dielectric medium. The dielectric medium has a predetermined dielectric constant. The at least one of the gas bubbles or gas-filled particles are sized and distributed in the dielectric medium to achieve a target dielectric constant of the dielectric bodies.

Electrical connector with signal pathways and a system having the same

A method for producing a surface mount device includes providing a plurality of layers including a B-staged top layer and bottom layer, and a C-staged middle layer with an opening. A core device is inserted into the openings, and then the top and bottom layers are placed over and under, respectively, the middle layer. The layers are cured until the layers become C-staged. The core device is substantially surrounded by an oxygen-barrier material with an oxygen permeability of less than approximately 0.4 cm3&#xb7;mm/m2&#xb7;atm&#xb7;day.

Oxygen-barrier packaged surface mount device

Embodiments of the invention generally provide a method and an apparatus for treating waste effluents from substrate polishing processes, such as from an electrochemical mechanical polishing (ECMP) process. In one embodiment, a method for treating a waste effluent mixture generated during a substrate process is provided which includes flowing a waste effluent comprising chelated metal complexes from a substrate process system, combining an oxidizing agent and the waste effluent to produce free chelators, flowing the waste effluent through an organoclay media and an activated carbon media to remove the free chelators, and flowing the waste effluent through an anion exchange resin to remove metal ions and produce a waste water.

Apparatus for treatment of chemical mechanical polishing fluid

The present invention generally comprises a method and an apparatus for recycling electrochemical mechanical polishing (ECMP) fluid. A selected portion of used ECMP fluid may be delivered to a recycling unit where the fluid may be refurbished. The concentration of the components that are present in the selected portion of used ECMP fluid may be measured. Based upon the measurements, individual components of the ECMP fluid may be selectively dosed into the selected portion in an amount sufficient to ensure that the selected portion of used ECMP fluid, once refurbished, contains the appropriate concentration of components. Alternatively, a predetermined amount of virgin ECMP fluid may be added to the selected portion. The refurbished ECMP fluid may be recycled into an ECMP system for use in another ECMP process.

Method and system for point of use recycling of ECMP fluids

Embodiments herein provide waste abatement apparatuses and methods for treating waste solutions derived from depleted or used plating solutions, such as from an electroless deposition process or an electrochemical plating process. The waste abatement systems and processes may be used to treat the waste solutions by lowering the concentration of, if not completely removing, metal ions or reducing agents that are dissolved within the waste solution. In one embodiment of a demetallization process, a waste solution may be exposed to a heating element (e.g., copper coil) contained within an immersion tank. In another embodiment, the waste solution may be exposed to a catalyst having high surface area (e.g., steel wool or other metallic wool) within an immersion tank. In another embodiment, the waste solution may be flowed through a removable, catalytic conduit (e.g., copper tubing) having an internal catalytic surface.

Method for treatment of plating solutions

A method for measuring the concentration of the metal solution and reducing agent solution within the electroless plating solution is disclosed. Raman spectroscopy is used to measure the concentration of each solution within the electroless plating solution after they have been mixed together. By measuring the concentration of each solution prior to providing the solution to a plating cell, the concentration of the individual solutions can be adjusted so that the targeted concentration of each solution is achieved. Additionally, each solution can be individually analyzed using Raman spectroscopy prior to mixing with the other solutions. Based upon the Raman spectroscopy measurements of the individual solutions prior to mixing, the individual components that make up each solution can be adjusted prior to mixing so that the targeted component concentration can be achieved.

Raman spectroscopy as integrated chemical metrology

A method of removing arsenic and fluoride from aqueous solutions in the same process is provided. Specifically, the pH of the aqueous solution is adjusted to a pH in the range of about 5 to 8. A combination of calcium salts, and ferric or aluminum salts are added to form insoluble arsenic and fluoride bearing solids. The solids are then removed from the aqueous solution.

Method for simultaneous removal of arsenic and fluoride from aqueous solutions

A method of treating industrial wastewaters is provided. Specifically, the wastewater includes one or more organic contaminant materials and is pre-treated prior to filtering by the following steps The pH of the wastewater is adjusted to a pH in the range of about 2 to 6, and a combination of iron salts and peroxide are added to the wastewater and allowed to react for a period of at least about three minutes. Next, the pH of the wastewater is adjusted upwards to a value of at least 7 and precipitating or flocculating agents are added to form an insoluble contaminant bearing compound. The compound is then filtered from the wastewater thereby removing the contaminant materials from the wastewater. This invention is particularly suited for use with single pass flow-through filters, and most particularly suitable for high flow rate single pass flow-through filters. The method of the present invention results in minimization of filter clogging and maintenance of high filtration flow rates, with reduced need for cleaning cycles using lengthy treatment by acid based or detergent mixtures.

Method of treating industrial waste waters

A process for removing contaminants from large volumes of wastewater is disclosed. The process involves treating a wastewater stream containing the contaminant with a coagulant that reacts with the contaminant to form a particulate or aggregate of particulates having a size greater than 10 &mgr;m. The treated wastewater is passed through a microfiltration membrane having a pore size in the range from 0.5 &mgr;m to 10 &mgr;m at low pressure (less than 20 psig) to remove the contaminant. Under such conditions, the treated wastewater flux rate is greater than 200 gallons per square foot of membrane per day (&ldquo;GFD&rdquo;), and typically from 200 to 1500 GFD.

Process and apparatus for high flow and low pressure impurity removal

A process and system for removing heavy metals, fluoride, silica and other contaminants from large volumes of wastewater is disclosed. In the process, a wastewater stream containing the contaminant is treated with a chemical coagulant to create a particle having a diameter greater than 5 microns. Treated wastewater is passed through a microfiltration membrane which physically separates the metal contaminant particle from the wastewater. Commercially available microfiltration membranes having a pore size from 0.5 micron to 5 microns may be used. The treated wastewater flow rate through the microfiltration membranes can range from 700 gallons per square foot of membrane per day (&ldquo;GFD&rdquo;) to 1500 GFD. Solids are removed from the membrane surface by periodically backflushing the micro-filtration membranes and draining the filtration vessel within which the membranes are located. The dislodged solid material within the filtration vessel is flushed into a holding tank for further processing of the solids.

Silica precipitate

This invention relates generally to new luminescent materials. Specifically, this invention relates to the discovery of phosphor materials in the forms of A.sub.2 BX.sub.4, ABX.sub.4-y :M and A.sub.3-z B.sub.5 X.sub.12 :M.sub.z. More specifically, this invention relates to the discovery of phosphor materials having compositions of matter in the forms, Sr.sub.2 CeO.sub.4, (Y.sub.0.82 Al.sub.0.07 La.sub.0.06)VO.sub.4 :Eu.sub.0.05 and (Y.sub.0.5 Gd.sub.0.5).sub.2.97 (Al.sub.0.5 Ga.sub.0.5).sub.5 O.sub.12 :CeO.sub.0.03.

Growing community of inventors

Santa Cruz, CA, United States of America

Josh Harris Golden