Montana Instruments Corporation

Josh Doherty

Anjan Reijnders

William Baker

Joseph Evers

Jamesen Motley

Luke Mauritsen

Ben Linkenhoker

Ryan Murdick

Benjamin Hardesty

Caleb Schreibeis

Jason Bilyeu

Bobby Riviere

Justin Whisenhunt

Jeremie Waller

Ben Hardesty

Switch assemblies for a cryogenic device analysis system are provided. The switch assembly can include: a cold source conductive member extending lengthwise to a cold source; and a cryogenic device conductive member extending lengthwise to a cryogenic device and at least partially overlapping at least a portion of the cold source conductive member. Methods for closing a conductive connection between a cold source and a cryogenic device within a cryogenic analysis system are provided. Methods for opening a conductive connection between a cold source and a cryogenic device within a cryogenic analysis system are provided. Cryogenic device analysis systems are also provided.

Cryogenic analysis systems and methods

Variable temperature analytical instruments and components are provided that can include: first and second conduits both configured to receive fluid from a cryofluid source and provide same to an analysis component; and a housing about the conduits wherein the housing is configured to maintain a vacuum about the conduits. Methods for maintaining temperatures within variable temperature analytical instruments are also provided. The methods can include dynamically providing fluid from a cryofluid source through at least one of two conduits housed within a vacuum, to an analysis component.

Analytical instruments, methods, and components

Cryogenic device analysis systems are provided that can include: a cold source within a first vacuum chamber; a cryogenic device mount within a second vacuum chamber, wherein the first and second vacuum chambers are separated by a vacuum barrier; a first thermal conduit extending from the cold source through the vacuum barrier to the sample mount; a first thermal switch along the first thermal conduit and operatively aligned between the cold source and the vacuum barrier. Methods for performing analysis of a cryogenic device are also provided.

Quantum processing circuitry cooling systems are provided. The systems can include a first chamber maintained at a first pressure; a second chamber maintained at a second pressure; a cooler within the first chamber; and quantum processing circuitry within the second chamber, the circuitry being thermally coupled to the cooler. Cooling systems are provided that can include: a cooler configured to generate and/or store cryofluid; a device thermally coupled to the cooler; and a plurality of thermal couplings between the cooler and the device, at least one of the thermal couplings being a first conduit system configured to convey cryofluid between the cooler and the device, wherein the first conduit system includes a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device. Methods for cooling quantum processing circuitry are provided.

Quantum processing circuitry cooling systems and methods

Thermal transfer line assemblies as well as methods for manufacturing thermal transfer line assemblies, and methods for transferring thermal energy are provided. In at least one embodiment a thermal transfer line assembly is provided that can include: a vacuum housing; a suspension support housing within the vacuum housing; a thermal conduit within the suspension support housing; in at least one cross section, a continuous outer void between the vacuum housing and the suspension support housing, an inner void between the suspension support housing and the thermal conduit; and a suspension system within the inner void and coupled to the suspension support housing but mechanically disconnected from the thermal conduit.

Thermal transfer line assemblies, methods of manufacturing thermal transfer line assemblies, and thermal transfer methods

Cryogenic analysis systems are provided that can include: a cryogenic fluid source component; an analysis component; and a thermal connection assembly operably engaged with both the cryogenic fluid source component and the analysis component to provide disengagement or engagement of the cryogenic fluid source component to/from the analysis component while maintaining the cooling status of the cryogenic fluid source component. Methods for performing sample analysis under cryogenic conditions are provided, the methods comprising: providing an analysis component; providing a cryogenic fluid source component having cryogenic fluid in a cold state; operably engaging the analysis component and the cryogenic fluid source component; preparing a sample for analysis within the analysis component; and while maintaining the cryogenic fluid in the cold state, disengaging the cryogenic fluid source component from the analysis component.

Thermal connection assemblies and methods

Cryocooler assemblies are provided that can include: a first mass configured to generate mechanical responses; a second mass operably engaged with the first mass; and an assembly between the first and second mass, the assembly configured to allow movement of the first mass in relation to the second mass. Methods for isolating mechanical responses within a cryocooler assembly are provided. The methods can include: generating a mechanical response about a first mass within a cryocooler assembly; suspending the first mass in relation to a second mass of the assembly; and operatively engaging the second mass as a cold source for the cryocooler assembly.

Cryocooler assemblies and methods

Quantum processing circuitry cooling systems are provided. The systems can include: a first chamber maintained at a first pressure; a second chamber maintained at a second pressure, wherein the first and second pressures are independent from one another; a cooler within the first chamber and operable to act as a cooling source for the cooling system; and quantum processing circuitry within the second chamber, the quantum processing circuitry being thermally coupled to the cooler. Cooling systems are also provided that can include: a cooler configured to generate and/or store cryofluid; a device thermally coupled to the cooler; and a plurality of thermal couplings between the cooler and the device, at least one of the thermal couplings being a first conduit system configured to convey cryofluid between the cooler and the device, wherein the first conduit system includes a first heat exchanger within the cooler and is configured to receive the cryofluid from the device, cool the cryofluid using the heat exchanger and provide cooler cryofluid to the device. Methods for cooling quantum processing circuitry are also provided. The methods can include providing cooling to quantum processing circuitry from a cooling source in a chamber having an independent pressure from the pressure about the quantum processing circuitry.

Variable temperature analytical instruments are provided that can include: a mobile component comprising a cold source; a substantially fixed analysis component; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a mobile analysis component; a substantially fixed component comprising a cold source; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in thermal communication with an analysis component; and at least one pressure barrier defining a plurality of discrete masses maintained at different temperatures between the cold source and the analysis component. Variable temperature analytical instruments are provided that can include: a cold source in thermal communication with an analysis component; and a plurality of discrete masses maintained at different temperatures about a single thermal communication between the cold source and the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly.

Variable temperature analytical instruments are provided that can include: a mobile component comprising a cold source; a substantially fixed analysis component; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a mobile analysis component; a substantially fixed component comprising a cold source; and an interface configured to couple the mobile component with the analysis component.

Variable temperature analytical instrument heat exchanger components are provided that can include a conduit in thermal communication with at least one thermally discrete mass, the discrete mass being configured as a cold source to be coupled to a member to facilitate the transfer of thermal energy. Variable temperature analytical instrument components are also provided that can include: a first mass to be maintained at a first temperature; a first conduit in fluid communication with the first mass; and a second mass thermally connected to the first conduit, the second mass having a different temperature than the first mass. Methods for varying the temperature within variable temperature analytical instruments are also provided. The methods can include thermally coupling at least a portion of an exhaust fluid conduit with a first mass and using the first mass as a cold source.

Variable temperature analytical instrument components are provided that can include: a conduit configured to extend between two chambers having different pressures; and a first mass about a section of the conduit, wherein the first mass is maintained at a first temperature. Variable temperature analytical instruments are provided that can include: a sample chamber configured to be operably coupled to a heat or cold source via one or more conduits; an interface component configured to engage the one or more conduits with the sample chamber, the interface comprising a conduit configured to extend between two chambers having different pressures; and a first mass about a section of the conduit, wherein the first mass is maintained at a first temperature. Methods for maintaining temperatures within a variable temperature analytical instrument are also provided. These methods can include maintaining a temperature within a conduit extending between two components of the instrument while each component is maintained at different pressures.

Variable temperature analytical instruments are provided that can include: at least one heat or cold source configured to generate a temperature; and discrete instrument portions individually thermally coupled to the at least one source. Methods for maintaining temperatures within variable temperature analytical instruments are also provided. The methods can include providing a plurality of thermal coupling between a plurality of discrete heat or cold sources to a plurality of discrete portions of the instrument.

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Bozeman, MT, United States of America

Josh Doherty