Ampleon Netherlands B.v.

Nxp B.v.

Josephus Van Der Zanden

Yi Zhu

Vittorio Cuoco

Rob Mathijs Heeres

Iouri Volokhine

Albert Gerardus Wilhelmus Philipus Van Zuijlen

Petra Christina Anna Hammes

Kanjun Shi

Youri Volkhine

Albert Van Zuijlen

Anna Walesieniuk

An integrated circuit package is provided. The integrated circuit package comprises a first and second guard bond wire. The first guard bond wire has a first and second end coupled to ground. The second guard bond wire has a first and second end coupled to ground. The integrated circuit package further comprises a die. The die is mounted between the first and second guard bond wires such that the first and second guard bond wires distort a magnetic field between at least an input terminal and an output terminal of the die.

Guard bond wires in an integrated circuit package

A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching network is coupled to the second terminal and comprises a first inductor and a first capacitor. The first inductor comprises first bond wire connections coupled between the second terminal and a first bond pad on the die, and second bond wire connections coupled between the first bond pad and a second bond pad coupled to the first capacitor.

Impedance matching configuration

A packaged Radio Frequency power transistor device is described, which comprises a component carrier a die comprising a semiconductor transistor having a source, a gate and a drain, wherein the die is mounted at the component carrier, a ground connection being electrically connected to the source, an output lead being electrically connected to the drain, a resonance circuit being electrically inserted between the output lead and the ground connection, and a video lead being electrically connected to the resonance circuit. The video lead is configured for being connected to a first contact of a decoupling capacitor. The ground connection is configured for being connected to a second contact of the decoupling capacitor. It is further described a RF power amplifier comprising such a packaged Radio Frequency power transistor device.

Packaged RF power transistor device having next to each other a ground and a video lead for connecting a decoupling capacitor, RF power amplifier

A transistor arrangement comprising an electrically conductive substrate; a semiconductor body including a transistor structure, the transistor structure including a source terminal connected to said substrate; a bond pad providing a connection to the transistor structure configured to receive a bond wire; wherein the semiconductor body includes an RF-return current path for carrying return current associated with said bond wire, said RF-return current path comprising a strip of metal arranged on said body, said strip configured such that it extends beneath said bond pad and is connected to said source terminal of the transistor structure.

Transistor arrangement

An amplifier structure comprising a transistor element having a plurality of sub-sections arranged adjacent to one another along a transistor element axis, a bias distribution element comprising a first part and a second part, the first part configured to receive a bias signal and the second part configured to supply the bias signal to each of the sub-sections of the transistor stage, wherein the first part is configured and arranged to deliver the bias signal to a distribution point and the second part is configured to diverge from the distribution point to provide the bias signal to each of the sub-sections of the transistor element, the distribution point arranged substantially facing a center point of the transistor element axis.

Amplifier structure

In RF power transistors, the current distribution along edges of the transistor die may be uneven leading to a loss in efficiency and in the output power obtained, resulting in degradation in performance. When multiple parallel dies are placed in a package, distribution effects along the vertical dimension of the dies are more pronounced. A RF power device () for amplifying RF signals is disclosed which modifies the impedance of a portion of the respective one of the input lead and the output lead and redistributes the current flow at an edge of the transistor die.

RF power device

An integrated circuit arrangement comprising a substrate and a flange disposed on top of the substrate. The flange comprises a cantilever portion configured to project over the substrate. A die disposed on top of the flange. A first output terminal disposed on the substrate. A first lead configured to provide for an electrical connection between the die and the first output terminal. A first electrically conducting member configured to provide at least part of a current return path between the substrate and the die and arranged to bridge a gap between the cantilever portion and the substrate. The first electrically conducting member is disposed between the die and the first output terminal and is configured to enable electrical current to flow from the substrate to the cantilever portion of the flange.

Growing community of inventors

Nijmegen, Netherlands

Josephus Van Der Zanden