International Business Machines Corporation

Joseph Ying-Yuen Chan

Hilton T Toy

Frank Louis Pompeo

John Blake Pavelka

A process for picking up and moving a microelectronic package during card assembly operations. A clipping lid having a top surface and at least two sides attaches to a substrate via friction where the sides act as leaf springs gripping the substrate. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. In the preferred embodiment, the lid and sides are formed from an integral piece of stainless steel. Also provided are flares at the bottom of each side to aid in guiding the lid onto the substrate. Protrusions are provided in the sides to prevent the lid from slipping too far onto the substrate and contacting the components mounted to the substrate. Also provided is at least one hole in the top surface to allow the lid to be pried free from the substrate after completion of the steps where vacuum probe movement is required.

Process for mechanically attaching a temporary lid to a microelectronic package

A process and apparatus for picking up and moving a microelectronic package during card assembly operations. A temporary lid having a top surface and a bottom surface attaches to at least one microchip on a substrate via a double-sided adhesive. The top surface of the lid provides a clean, smooth, flat surface to which a vacuum probe may be attached. After completion of the steps where vacuum probe movement is required, the lid and adhesive may be removed from the at least one microchip by pulling them both off together. No residue is left on the microchips.

Growing community of inventors

Fishkill, NY, United States of America

Joseph Ying-Yuen Chan