Maxim Integrated Products, Inc.

Joseph W Serpiello

Viren V Khandekar

Karthik Thambidurai

Tiao Zhou

Yong L Xu

Md Kaysar Rahim

Semiconductor package devices, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar.

Growing community of inventors

Plano, TX, United States of America

Joseph W Serpiello