Altera Corporation

Joseph W Foerstel

Adam J Wright

Mark Andrew Banke

Ken A Ito

Jon M Long

Saiid Rezvani

Ronald M Beach

Sandeep Vij

J Stephen Paine

James Stephen Paine

A system for testing a device under test (DUT), in which electrical coupling among a module board, a low profile connector, and, a DIB is established by applying a pressure on the module board toward the DUT, is provided. The system includes a test head bracket secured inside a test head, the test head bracket includes the module board having a first section including a plurality of connectors to couple a test analyzer to the module board, a second section including a plurality of contacts pads to electrically couple the module board to the DUT, and, a flexible board to enable the first section to be placed at an angle with respect to the second section. The test head bracket also includes a module board stiffener mechanically securing the first section and the second section to the test head and the low profile connector electrically couples the module board to the DUT.

Apparatus for a low-cost semiconductor test interface system

A touch-down counter is provided that maintains a count of how many times integrated circuits are placed into contact with a contactor in a test handler. The test handler has a work press that places integrated circuits into contact with pogo pins in the contactor. The pins are subject to wear and should be maintained by periodic cleaning. The touch-down counter has a sensor such as a non-contact Hall effect sensor that is attached to the contactor. A magnet is affixed to the side of the work press. When the work press comes into the vicinity of the sensor, the sensor detects the presence of the magnet and registers a contactor touch-down event. A lifetime count of touch-down events may be displayed on the counter. When a recommended threshold value of touch-down events has been exceeded, a test system operator can remove the contactor from use for cleaning.

Touchdown counter for integrated circuit testers

An elongated bonding pad comprises two areas, a bonding area and an elongated probing area. The bonding area is located on the edge of an integrated circuit device for wire bonding. The elongated probing area is located on the inner area of the device. The long dimension of the elongated probing area is large enough for carrying a probing mark and the short dimension of the probing area is electrically and mechanically connected to the bonding area. Such elongated bonding pad can reduce the possibility of bonding wire open failures caused by wafer sort probing and increase the device's capacity of hosting more electrical components.

Elongated bonding pad for wire bonding and sort probing

A test head apparatus for use in electronic device test equipment includes a test head with an annular test head body including a probe card carrier attachment region of a first circumference and a test electronic card storage region with a second circumference greater than the first circumference. The probe card carrier attachment region of the test head body is compatible with probe card carriers for existing test heads. The enlarged test electronic card storage region provides more space for electronic equipment, while providing more viewing area of the probe card. The apparatus also includes an improved probe card attachment configuration.

Test head apparatus for use in electronic device test equipment

A method of loading an electronic component into a carrier includes the step of setting an electronic component onto a pedestal including a pedestal post. A carrier with a clip is positioned over the pedestal. The pedestal post is forced against the clip such that the clip is in a retracted position that allows the electronic component to be positioned in the carrier. The pedestal post is then removed from the clip so that the electronic component is secured in the carrier by the clip.

Apparatus and method for loading an electronic component into a carrier

An apparatus and method are disclosed to permit handling an electronic device (20) during programming, development, and other steps. The apparatus include a carrier (2) having a cavity (15) in which the electronic component is immobilized and protected during handling. The carrier cavity can have an opening that permits access to the electronic component. The carrier/device combination is inserted into a socket (35) which includes a plurality of leads (30) with associated contacts for making electrical connection with the electronic component leads (21). The leads of the socket have a footprint identical to that of the electronic component.

Growing community of inventors

Santa Clara, CA, United States of America

Joseph W Foerstel