Qualcomm Incorporated

Joseph Victor Zanotelli

Raghu Narayan Challa

Arunava Chaudhuri

Mrinal Mahesh Nath

Hemanth Sampath

Jon James Anderson

Martin Saint-Laurent

Jeremy H Lin

Victor Adrian Chiriac

Iwen Yao

Sorin Adrian Dobre

Weihong Jing

Kaushik Ghosh

Ali RostamPisheh

Maria G Lupetini

Megan Wu

Mrinal M Nath

A processor having a multi-Vt critical path is provided that includes both low-Vt devices and high-Vt devices. If the processor is operating in a high performance mode, the multi-Vt critical path is controlled so as to use the low-Vt devices. Conversely, if the processor is operating in a low power mode, the multi-Vt critical path is controlled so as to use the high-Vt devices. In this fashion, the complication of multiple processing cores is avoided in that a single processor core can operate in both the high performance mode and in the low power mode.

Multiple critical paths having different threshold voltages in a single processor core

A configurable decoder within a receiver (for example, within a wireless communication device) includes numerous decoders. In one mode, the multiple decoders are used to decode different sub-packets of a packet. When one decoder completes decoding the last sub-packet assigned to it of the packet, then that decoder generates a packet done indication. A control circuit receives the packet done indications, and when all the decoders have generated packet done indications then the control circuit initiates an action. In one example, the action is the interrupting of a processor. The processor responds by reading status information from the control circuit, thereby resetting the interrupt. End-of-packet markers are usable to generate packet done indications and to generate EOP interrupts. Similarly, end-of-group markers are usable to generate group done indications and to generate EOG interrupts. The decoder block is configurable to process sub-packets of a packet using either one or multiple decoders.

Efficient parallel sub-packet decoding using multiple decoders

Various embodiments of methods and systems for controlling and/or managing thermal energy generation on a portable computing device are disclosed. Data discarded from one or more processing core registers may be monitored and analyzed to deduce individual workloads that have been processed by each of the cores over a unit of time. From the deduced workloads, the power consumed by each of the cores over the unit of time in order to process the workload can be calculated. Subsequently, a time dependent power density map can be created which reflects a historical and near real time power consumption for each core. Advantageously, because power consumption can be correlated to thermal energy generation, the TDPD map can be leveraged to identify thermal aggressors for targeted, fine grained application of thermal mitigation techniques. In some embodiments, workloads may be reallocated from the identified thermal aggressors to the identified underutilized processing components.

On-chip thermal management techniques using inter-processor time dependent power density data for indentification of thermal aggressors

A flexible and reconfigurable digital system (for example, a wireless modem) includes a set of sub-circuits. Each sub-circuit includes a task manager and an amount of configurable hardware circuitry for performing a type of operation on a data stream. The task manager of a sub-circuit can configure and control the configurable hardware of the sub-circuit. A central processor configures and orchestrates operation of the sub-circuits by maintaining a set of task lists in a tightly coupled memory. Each task list includes task instructions for a corresponding sub-circuit. The task manager of a sub-circuit reads task instructions from its task list and controls its associated hardware circuitry as directed by the instructions. A timestamp task instruction and a push task instruction and the task list architecture allow modem sub-circuits to be easily reconfigured to operate in accordance with either a first air interface standard or a second air interface standard.

Reconfigurable wireless modem sub-circuits to implement multiple air interface standards

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San Diego, CA, United States of America

Joseph Victor Zanotelli