Neuropace, Inc.

Hewlett-packard Company

Agilent Technologies, Inc.

Joseph Vandenburg

Dennis Potts

Paul M Paspa

C Lance Boling

Dunagan Pearson

Jerzy Roman Sochor

James L Bertsch

Michel G M Perbost

Darrell L Gourley

John McEntee

J Michael Flanagan

Edward Aisawa

Val C Robinson

J Dunagan Pearson

Jerzy A Sochor

A device for implant in a hole in cranium relative to a bone table includes a can having an electrical-contact pad. The can has a perimeter edge defining a boundary, and a recessed portion with an upper surface positioned to lie beneath the bone table when the can is placed in the hole. The device also include a cover assembly that couples to and decouples from the can at the electrical-contact pad. A strain relief system includes a lower strain relief and an upper strain relief. The lower strain relief defines channels that receive a portion of a lead and includes a curved portion that extends upward from the upper surface of the recessed portion to the bone table, and a linear portion that extends from the curved portion to an end beyond the perimeter edge. The upper strain relief couples to and decouples from the can and/or the lower strain relief.

Strain relief systems for active implantable medical devices

A printed circuit assembly (PCA) for coupling to an IMD feedthrough of an implantable medical device includes a PCB portion and an interposer. The IMD feedthrough has a support structure and a plurality of electrical contacts extending through the support structure. The PCB portion is configured to be arranged relative to the support structure of the IMD feedthrough and includes a plurality of electrical contacts. The interposer is secured to the PCB portion and includes a dielectric over-mold structure and a plurality of leads. Each lead is integrated with the dielectric over-mold structure and includes a weld pad and a solder pad. Each solder pads of the interposer is electrically coupled to a corresponding electrical contacts of the PCB portion to provide an alignment between one or more weld pads of the interposer and one or more corresponding electrical contacts of the IMD feedthrough.

Interposer for active implantable medical device

An implantable medical device includes a cover assembly and a feedthrough assembly that couples with the cover assembly. The cover assembly receives a connector end of a lead having lead contacts, and aligns the lead contacts with pockets or apertures of the cover assembly. The feedthrough assembly may include feedthrough contacts in the form of feedthrough pins at or above a surface of a feedthrough substrate, or conductive vias on the surface of the substrate. Electrical contacts configured as leaf spring contact assemblies, torsion spring contacts, or torsion spring contact assemblies are permanently attached to the feedthrough contacts. When the cover assembly and feedthrough assembly are coupled, contact tabs of the electrical contacts are positioned in the pockets or apertures of the cover assembly. Upon complete seating of the cover assembly and feedthrough assembly, the contact tabs are compressed into contact with the lead contacts.

Connector assembly for active implantable medical device

A connector assembly includes a cover assembly and a feedthrough assembly that couples with the cover assembly. The cover assembly receives a connector end of a lead having lead contacts, and aligns the lead contacts with pockets or apertures of the cover assembly. The feedthrough assembly may include feedthrough contacts in the form of feedthrough pins at or above a surface of a feedthrough substrate, or conductive vias on the surface of the substrate. Electrical contacts configured as leaf spring contact assemblies, torsion spring contacts, or torsion spring contact assemblies are permanently attached to the feedthrough contacts. When the cover assembly and feedthrough assembly are coupled, contact tabs of the electrical contacts are positioned in the pockets or apertures of the cover assembly. Upon complete seating of the cover assembly and feedthrough assembly, the contact tabs are compressed into contact with the lead contacts.

An implantable medical device includes an enclosure having a sidewall and a welded seam in the sidewall, the seam extends along a perimeter of the enclosure. A thermoform is located adjacent a surface of the enclosure and is secured in place within the enclosure. A metalized surface is located adjacent an interior surface of the enclosure sidewall and is secured in place by the thermoform. The metalized surface extends along a perimeter of the enclosure and is configured to obstruct laser energy during a weld seam process. The metalized surface may be provided as a separate backup band component or may be integrated in a perimeter sidewall of the thermoform.

Integrated backup band for use in forming an enclosure for a medical device

Neurostimulator assembly

Neurostimulator

Methods and compositions for modifying a substrate surface are provided. In accordance with the subject methods, a substrate surface is contacted with a particulate-containing fluid. The fluid is then ultrasonically or sonically agitated to modify the substrate surface. In certain embodiments, the particulate-containing fluid has a pH above the isoelectric point of the substrate. Also provided are devices capable of providing ultrasonic and/or sonic energy and which include a non-acidic, particulate-containing fluid. The subject invention also provides systems and kits for use in practicing the subject methods.

Methods and devices for modifying a substrate surface

The invention relates to an ionization chamber. More particularly, the invention relates to a mass spectrometer system having an ionization chamber incorporating a corona needle removable from outside the closed ionization chamber. In preferred embodiments, the corona needle is self-positioning and engages and disengages operational or safety electrical connections.

Growing community of inventors

Mountain View, CA, United States of America

Joseph Vandenburg