Intel Corporation

Joseph Van Nausdle

Yiqun Bai

Ziyin Lin

Omkar G Karhade

Digvijay Ashokkumar Raorane

Mitul Bharat Modi

Edvin Cetegen

Dingying David Xu

Nicholas S Haehn

Vipul V Mehta

Bassam Mohammed Ziadeh

Jingyi Huang

Vaibhav Agrawal

Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.

Hydrophobic feature to control adhesive flow

Techniques and mechanisms for facilitating heat conductivity in a packaged device with a dummy die. In an embodiment, a packaged device comprises a substrate and one or more IC die coupled to a surface thereof. A dummy die, adjacent to an IC die and coupled to a region of the substrate, comprises a polymer resin and a filler. A package mold structure of the packaged device adjoins respective sides of the IC die and the dummy die, and adjoins the surface of the substrate. In another embodiment, a first CTE of the dummy die is less than a second CTE of the package mold structure, and a first thermal conductivity of the dummy die is greater than a second thermal conductivity of the package mold structure.

Dummy die structures of a packaged integrated circuit device

Growing community of inventors

Chandler, AZ, United States of America

Joseph Van Nausdle