Cisco Technology, Inc.

Joseph V Pampanin

Craig S Appel

Sanjay Sunder

Peter C Metz

Prajwal M Kasturi

Abhishek Bhat

A voltage-controlled oscillator (VCO) is disclosed that includes an inductor-capacitor (LC) tank coupled with a first voltage supply node, a pair of cross-coupled transistors that are coupled with the LC tank and coupled with each other at a tail node, and a high-frequency current return path to the first voltage supply node. The high-frequency return path includes a first decoupling capacitor coupled with the first voltage supply node and a second voltage supply node, and a first inductor coupled with the tail node and the second voltage supply node. The first inductor is formed as a first conductive trace and has a quality factor (Q) value of 25 or greater.

Inductive-capacitive voltage-controlled oscillator with increased common-mode impedance

Embodiments provide for a tunable driving circuit by monitoring a frequency of a ring oscillator of an electrical integrated circuit connected to an optical modulator to determine operational characteristics of the electrical integrated circuit; setting, based on the operational characteristics, a driving voltage for a plurality of tunable inverters and a plurality of fixed gain inverters that control the optical modulator, wherein each tunable inverter of the plurality of tunable inverters is connected in parallel with a corresponding fixed gain inverter of the plurality of fixed gain inverters on one of a first arm and a second arm connected to the optical modulator; and setting an amplification strength for the plurality of tunable inverters based on the operational characteristics.

Tunable driver

The fault detection system described provides an efficient method to test and monitor component to component connectivity in an electronic package using on chip test circuits and on chip components, which reduces the need for external testing equipment and analysis. The on chip nature allows for both real time testing in the assembly process of the electronic packages and during use of the electronic package by determining an on chip reference measurement and using the reference measurement to determine an operational status of the package.

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Hellertown, PA, United States of America

Joseph V Pampanin