Cypress Semiconductor Corporation

Joseph Tzou

Thinh Tran

Jun Li

Suresh Parameswaran

Morgan Andrew Whately

Gabriel M Li

Bruce Barbara

Christopher Lee

Jithender Majjiga

A method can include storing a plurality of addresses within one cycle of a timing clock, each address corresponding to a storage location of a memory device; and following the one cycle, accessing a plurality of banks of the memory device in response to the stored addresses corresponding to different banks and preventing access to any one of the plurality of banks by more than one address of the one cycle; wherein each bank includes memory cells arranged into rows and columns that comprise the storage locations.

Access methods and circuits for memory devices having multiple banks

An integrated circuit (IC) device can include a plurality of banks, each including a plurality of memory cells, and separately accessible according to a received bank address value, each bank configured to enable accesses on different phases of an internal clock signal; and a plurality of channel groups, each channel group including a plurality of channels, each channel including its own data connections, address connections, and control input connections for accessing the banks, the channels of different groups accessing the memory banks on the different phases of the internal clock signal.

Access methods and circuits for memory devices having multiple channels and multiple banks

A memory device can include a memory array section; a write first-in-first-out circuit (FIFO) configured to transfer write data to the memory array portion; at least one store circuit configured to store a copy of at least a portion of the write data stored in the write FIFO; and an address compare section configured to store write addresses corresponding to the write data of the forwarding circuit.

Data forwarding circuits and methods for memory devices with write latency

A method can include storing bank addresses, if received, on at least rising and falling edges of a same clock cycle; and if addresses stored on the rising and falling edges of the same clock cycle correspond to different banks of a memory device, starting accesses to both banks after the falling edge of the clock cycle; wherein any of the banks can be accessed in response to an address stored on a rising edge of a next clock cycle. Devices and additional methods are also disclosed.

A memory device can include a data path that includes a first-in-first-out circuit (FIFO) to transfer data according to a latency between at least one memory cell array and signal connections of the memory device, the latency corresponding to a number of cycles of a periodic clock; and a self-timed section configured to transfer data independent of the clock. In addition or alternatively, a memory device can include at least one memory cell array; and a FIFO configured to transfer data between at least one memory cell array and other portions of the memory device according to a periodic clock signal, FIFO introducing a latency into the data according to a control signal generated in response to an access command. Methods corresponding to the above devices and operations are also disclosed.

Memory device data latency circuits and methods

A method of accessing a memory device multiple times in a same time period can include, in a first sequence of accesses, starting an access operation to one of a plurality of banks in synchronism with a first part of a first clock cycle and starting an access operation to another of the plurality of banks in synchronism with a second part of the first clock cycle, each bank having separate access circuits; and the time between consecutive accesses is faster than an access speed for back-to-back accesses to a same one of the banks; wherein during the access operations, storage locations of each bank are accessed in a same time period.

Memory device and method

A memory device and method may include separating alternating read and write accesses to different banks of a memory device.

In an embodiment, an apparatus includes a memory controller configured to control first and second memory components. A point-to-point data bus configured to pass data between the memory controller and the memory components may include a direct connection from each memory component to the memory controller. A daisy chained address bus configured to pass commands between the memory controller and the memory components may include a direct connection from the first memory component to the memory controller and a daisy chain connection from the first memory component to the second memory component.

Memory system and method

An integrated circuit may include at least a first replica driver stage coupled between a reference impedance input and a first power supply node and having a first programmable driver impedance set by a first driver configuration value in the same manner as a first output driver section of the integrated circuit. At least a first replica input termination stage may be coupled between the reference impedance input and the first power supply node and having a first programmable termination impedance set by a first termination configuration value in the same manner as a first input termination section of the integrated circuit. An impedance programming circuit may generate at least the first driver configuration value and the first termination configuration value in response to a potential at the reference node.

Circuits and methods for programming integrated circuit input and output impedances

An improved circuit and method for programmable cascading of impedance matching in a multi-chip configuration are disclosed. Handshaking is implemented in cascaded chips by defining a master-slave configuration, and impedance is evaluated in cascaded chips in a non-overlapping manner. The circuit includes a plurality of chips arranged in a cascading configuration. A cascade output pin of a chip is coupled to a cascade input pin of a cascaded chip to enable handshaking between the plurality of chips. The plurality of chips are coupled to a common precision resistor via a common impedance line to enable each chip to calibrate impedance of the chip. Each of the plurality of chips includes a control circuit. Each control circuit includes a state machine circuit. The control circuit is configured to control a non-overlapping clock cycle of each chip during which the impedance of the chip is evaluated.

Circuit and method for cascading programmable impedance matching in a multi-chip system

Embodiments of the invention relate to the testing and reduction of read disturb failures in a memory, e.g., an array of SRAM cells. A read disturb test mode may be added during wafer sort to identify any marginal memory cells that may fail read disturb, thus minimizing yield loss. The read disturb test mode may include first writing data to the memory. After a predetermined time period, the read disturb test mode reads data from the same memory, and compares the read data with the data previously written to the memory. A repair signal may be generated, when the read data is different from the data previously written to the memory. Additionally, a system may be implemented to reduce read disturb failures in the memory. The system may include a match logic circuit and a data selecting circuit. When a match condition is satisfied, data is read from a register that stores the previous written data, instead of from the memory. The match logic circuit may be selectively enabled or disabled.

Memory having read disturb test mode

Disclosed is an accumulation memory circuit for providing a fast read, modify, and write operation in a single clock cycle time. The memory circuit is configured to read data stored in the memory device at an address. The memory circuit includes a reconfigurable adder unit generating read, accumulate and write output in a single clock cycle. The memory circuit is further configured to minimize data overflow. A high speed accumulation method comprises resetting a memory circuit; reading from an address of the memory circuit; performing internal addition within the memory circuit and rewriting into the address of the memory circuit in a single clock cycle.

Area efficient and fast static random access memory circuit and method

Synchronous SRAM may conform to Std. Sync or early-write at an external interface whilst providing late-write internally.

Single late-write for standard synchronous SRAMs

An integrated circuit device () can include a main portion () and a built-in self-test (BIST) portion () having outputs coupled to physical input structures (e.g., bond pads) () of the integrated circuit device (). A BIST portion () can test timing critical parameters that take into account the effect of input structures (). A BIST portion () can apply BIST test signals with a pipeline structure that can emulate timing parameters, such as a set-up time (Ts) and a clock-to-output time (Tco).

Method and apparatus for built-in self-test (BIST) of integrated circuit device

A memory device can include a group of memory cells, which can be arranged in a column () that receives power by way of a first cell supply nodes (-to-). A current limiter () can be situated between first cell supply nodes (-to-) and a power supply (VH), and limit a current (llimit) to less than a latch-up holding current (lhold_lu) for the group of memory cells (). In a particle event, such as an &#x3b1;-particle strike, a current limiter () can prevent a latch-up holding current (lhold_lu) from developing, thus preventing latch-up from occurring. Current limiter () can include p-channel transistors and/or resistors, and thus consume a relatively small area of the memory device.

Growing community of inventors

Mountain View, CA, United States of America

Joseph Tzou