Dupont Photomasks, Inc.

Toppan Photomasks, Inc.

Joseph Stephen Gordon

Franklin Dean Kalk

Gregory P Hughes

Hakki Ufuk Alpay

Xiaoming Chen

Glenn Edward Storm

Xun Zhang

Julio R Reyes

Janice M Paduano

Craig A West

James A Carroll, Iii

H Ufuk Alpay

Susan S MacDonald

A photomask assembly and method for protecting the photomask assembly from contaminants generated during a lithography process are disclosed. A photomask assembly includes a pellicle assembly formed from a pellicle frame and a pellicle film coupled to a first surface of the pellicle frame. The pellicle frame further includes an inner wall and an outer wall. A photomask is coupled to a second surface of the pellicle frame opposite the pellicle film. A molecular sieve that prevents airborne molecular contaminants (AMCs) generated during a lithography process from contaminating the photomask is associated with the pellicle assembly.

Photomask assembly and method for protecting the same from contaminants generated during a lithography process

An apparatus and method for optimizing a pellicle for off-axis transmission are disclosed. A pellicle includes a thin film optimized for transmission of off-axis incident light at a desired angle. The pellicle further includes an optical thickness greater than a design thickness by less than or equal to approximately one-quarter of an exposure wavelength.

Apparatus and method for optimizing a pellicle for off-axis transmission of light

A method and apparatus for coupling a pellicle to a photomask using a non-distorting mechanism are disclosed. A pellicle is coupled to a photomask with a non-distorting mechanism that is located on a pellicle frame opposite a thin film coupled to the pellicle frame. The non-distorting mechanism acts to reduce stress exerted on the photomask by the pellicle.

Method and apparatus for coupling a pellicle to a photomask using a non-distorting mechanism

A method for constructing a photomask assembly using an encoded mark is disclosed. The method includes comparing a first encoded mark located on a photomask with a second encoded mark located on a pellicle. The first encoded mark includes one or more first symbols and the second encoded mark includes one or more second symbols. The method further includes mounting the pellicle on the photomask if at least one of the symbols of the first encoded mark matches at least one of the symbols of the second encoded mark.

Method for constructing a photomask assembly using an encoded mark

A method for fabricating a damage resistant photomask includes forming a photomask pattern on a substrate and forming a transparent, protective coating on the photomask pattern. The protective coating may be an electrical insulator (e.g., spin-on glass). In addition, an antireflective layer may be applied to the protective coating. A pellicle may also be attached over the protective coating. The protective coating may prevent electrostatic energy from forming on or arcing between features on the photomask pattern and damaging the features. The protective layer may also prevent the photomask pattern from being damaged by or reacting with other substances, such as cleaning solutions.

Damage resistant photomask construction

A photomask and a method for forming an opaque border on the same are disclosed. In an example method of manufacturing a photomask, no more than one patterning operation is used to form a mask field with an opaque border substantially surrounding the mask field. The border region may be substantially covered by an opaque material, and features in the mask field may be free from the opaque material. When the photomask is used to expose a pattern on an object, the opaque border may substantially prevent electromagnetic radiation (EMR) from exposing portions of the object outside the field of exposure associated with the mask field. The operation of forming the mask field may include forming an insulating clear region surrounding the features and leaving the border region outside the insulating clear region. The opaque layer may be deposited by electroplating or spraying an opaque material onto the border region.

Photomask and method for forming an opaque border on the same

A dust cover having a film with an inorganic, anti-reflective coating and method for use during semiconductor fabrication. The dust cover is primarily for use during photolithography. The dust cover may include an amorphous fluoropolymer film having an inorganic, anti-reflective coating attached to a frame. The inorganic, anti-reflective coating preferably has a refractive index below 1.4.

Growing community of inventors

Gardiner, NY, United States of America

Joseph Stephen Gordon