Semiconductor Components Industries, LLC

Joseph Steffler

Gareth Pryce Weale

Mark Vandermeulen

Yik Yee Tan

Sukhminder S Binapal

In an embodiment, an antenna may be formed by applying an insulator to a package body and forming at least a portion of the antenna as a conductor on the insulator.

Semiconductor device and package

Method of forming a semiconductor device

A semiconductor device package includes a heatsink platform, with a ceramic isolation layer bonded to the heatsink platform. A semiconductor die may be disposed on the ceramic isolation layer, with mold material disposed on the ceramic isolation layer and surrounding at least a portion of the semiconductor die. A redistribution layer may be disposed on the semiconductor die and the mold material. Such packages, and similar, enable the use of a thin, inexpensive device substrate, while providing an efficient thermal path to the heatsink platform, while the redistribution layer enables electrical connections that are short, low-resistance, low-inductance, and low-loss connections.

Package structure for semiconductor devices

Implementations of semiconductor packages may include: a first semiconductor die having a plurality of balls coupled to a first side thereof, a second semiconductor die, a lead frame having a die attach area on a first side of the lead frame, the die attach area containing an opening therethrough and one or more wire bonds. The first semiconductor die may be coupled to a backside of the second semiconductor die by an adhesive on a second side of the first semiconductor die opposing the first side. The second semiconductor die may be mechanically and electrically coupled to the lead frame through one or more wire bonds at the die attach area. The first semiconductor die may be positioned within the opening in the center of the lead frame.

Growing community of inventors

Waterloo, Canada

Joseph Steffler