Alcatel Lucent

Nokia Solutions and Networks Oy

Joseph Smetana, Jr

Darrell W Barabash

Abhijit Ghose

According to an aspect, there is provided a printed circuit board-based resistive device. The resistive device comprises, arranged on a substrate of the printed circuit board of the printed circuit board: a first conductive pad; a second conductive pad; a resistive patch having a first longitudinal end connected to the first conductive pad and a second longitudinal end connected to the second conductive pad, wherein a width of the resistive patch varies along a length of the resistive patch and has a maximum at a point between the first and second longitudinal ends.

Resistive device

A method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board are described herein. In the preferred embodiment, the printed circuit board includes a via extending through a plurality of stacked layers. The via includes a plated through hole and a back-drilled hole. The plated through hole is located within a predetermined number of the stacked layers and the back-drilled hole is located within the remaining stacked layer(s). The plated through hole without an electrically conductive material located on walls therein has a diameter that is substantially the same size or smaller than the diameter of the back-drilled hole.

Growing community of inventors

Rockwall, TX, United States of America

Joseph Smetana, Jr