Sperry Corporation

Joseph S Mathias

Faquir C Mittal

A multichip thermal conduction module has improved cooling in a housing having at least one board mounted therein including a plurality of chips on the board. A heat conducting plate is mounted in the housing adjacent the chips. A cold plate abuts heat conducting plate and includes an inlet an outlet connected to a coolant passage formed therein for guiding a coolant through the housing. Flexible heat conductors are connected to the heat conducting plate and are urged into aligned contact with the chips for conducting heat therefrom. The flexible conductors are in fluid communication with the cold plate passage for conducting coolant adjacent the chips.

Apparatus for cooling integrated circuit chips

A multichip thermal conduction module has improved cooling in a housing having a board including chips mounted on the board. The housing is divided so as to form first and second cooling portions. The chips are in the first cooling portion. Several bellows extend into the first cooling portion so that each bellows is urged into deflecting contact with a respective chip. A plurality of heat conducting strands are mounted in each bellows and extend into the second cooling portion. A fluid coolant is directed to flow across the heat conducting strands.

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Riverton, NJ, United States of America

Joseph S Mathias